Zobrazeno 1 - 1
of 1
pro vyhledávání: '"Mark B. Trobough"'
Autor:
James E. Jaussi, Kent E. Mallory, Victor Prokofiev, Mike Leddige, Mark B. Trobough, Bryce D. Horine, Jason A. Mix, P.C.H. Meier, Rajashree Baskaran, Henning Braunisch, Daoqiang Lu, Dong-Ho Han
Publikováno v:
IEEE Transactions on Advanced Packaging. 31:82-90
High-speed chip-to-chip interconnect utilizing flex-circuit technology is investigated for extending the lifetime of copper-based system-level channels. Proper construction of the flex ribbon is shown to improve the raw bandwidth over standard FR-4 b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9297ad294ed40fe2c1a8584dc01c015f
https://doi.org/10.1109/tadvp.2007.909451
https://doi.org/10.1109/tadvp.2007.909451
