Zobrazeno 1 - 10
of 13
pro vyhledávání: '"Mario Rotigni"'
Autor:
Roberto DeChecchi, Kristoffer Sander Skytte, Andrea Barletta, Mauro Merlo, Renato Castellan, Valentino Liberali, Mario Rotigni, Aurora Sanna, Paolo Colombo
Publikováno v:
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo).
A dedicated test chip has been designed in order to support the study of the EMC performance, and more specifically the Conducted Emission, of a microcontroller family in M28 FDSOI technology. The focus in designing the test chip has been put on the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a73e140b8d2a88034fa0532802e6f439
https://doi.org/10.1109/emccompo.2019.8919707
https://doi.org/10.1109/emccompo.2019.8919707
Publikováno v:
2017 11th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMCCompo).
This paper briefly recalls the design of a silicon test chip specially conceived to study the noise propagation trough the silicon substrate and the ESD protection. The noise source is a logic block designed to emulate the clock tree of a microcontro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f14920997f9b18055a694a9fcdae8ccf
https://doi.org/10.1109/emccompo.2017.7998102
https://doi.org/10.1109/emccompo.2017.7998102
Publikováno v:
EMC Compo
This paper presents the design of a silicon test chip specially conceived to study the noise propagation trough the silicon substrate in order to build up a model to be used in simulating EMC performances —both emission (EME) and immunity (EMI)—
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::99908bcfd0b2282ed19c6bd494b452d5
https://doi.org/10.1109/emccompo.2015.7358338
https://doi.org/10.1109/emccompo.2015.7358338
SUMMARY This paper provides an investigation of power distribution network (PDN) performance by a full-wave prediction tool and by experimental measurements. A set of six real boards characterized by increasing complexity is considered in order to es
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c375205a7b64a3bbd3fee70494c2350e
http://hdl.handle.net/11573/45677
http://hdl.handle.net/11573/45677
Autor:
PATRICE JOUBERT DORIOL, VILLAVICENCIO AREVALO, YAMARITA DEL CARMEN, Cristiano, Forzan, Mario, Rotigni, Giovanni, Graziosi, Davide, Pandini
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od______2153::aaf145a2d74e85b9bdd5ed75cb72e700
http://hdl.handle.net/11583/2263680
http://hdl.handle.net/11583/2263680
Autor:
Giovanni, Graziosi, PATRICE JOUBERT DORIOL, VILLAVICENCIO AREVALO, YAMARITA DEL CARMEN, Cristiano, Forzan, Mario, Rotigni, Davide, Pandini
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od______2153::d649e179e0b5f2ab740d88cf592fb595
http://hdl.handle.net/11583/2264112
http://hdl.handle.net/11583/2264112
Autor:
PATRICE JOUBERT DORIOL, VILLAVICENCIO AREVALO, YAMARITA DEL CARMEN, Cristiano, Forzan, Mario, Rotigni, Giovanni, Graziosi, Davide, Pandini
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od______2153::387c6522685915273fb6b8e4d28c1846
http://hdl.handle.net/11583/1876395
http://hdl.handle.net/11583/1876395
Publikováno v:
Health & Medicine Week; 9/20/2024, p8414-8414, 1p
Publikováno v:
2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo); 2015, pii-ii, 1p
Publikováno v:
2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo); 2015, p97-102, 6p