Zobrazeno 1 - 10
of 68
pro vyhledávání: '"Marieb, T."'
Autor:
Choi, Z.-S., Gan, C.L., Wei, F., Thompson, Carl V., Lee, J.H., Marieb, T., Maiz, J., Pey, Kin Leong, Choi, Wee Kiong
The median-times-to-failure (t₅₀’s) for straight dual-damascene via-terminated copper interconnect structures, tested under the same conditions, depend on whether the vias connect down to underlaying leads (metal 2, M2, or via-below structures)
Externí odkaz:
http://hdl.handle.net/1721.1/3826
Publikováno v:
Journal of Applied Physics; 6/15/2001, Vol. 89 Issue 12, p7797, 12p, 9 Black and White Photographs, 1 Diagram, 1 Chart, 9 Graphs
Publikováno v:
Journal of Applied Physics; 7/15/1995, Vol. 78 Issue 2, p1026, 7p, 9 Black and White Photographs
Autor:
Spolenak, R., Barr, D.L., Gross, M.E., Evans-Lutterodt, K., Brown, W.L., Tamura, N., MacDowell, A.A., Celestre, R.S., Padmore, H.A., Valek, B.C., Bravman, J.C., Flinn, P., Marieb, T., Keller, R.R., Batterman, B.W., Patel, J.R.
Publikováno v:
Spolenak, R.; Barr, D.L.; Gross, M.E.; Evans-Lutterodt, K.; Brown, W.L.; Tamura, N.; et al.(2001). Microtexture of Strain in electroplated copper interconnects. Lawrence Berkeley National Laboratory. Lawrence Berkeley National Laboratory: Lawrence Berkeley National Laboratory. Retrieved from: http://www.escholarship.org/uc/item/8mf0v79p
The microstructure of narrow metal conductors in the electrical interconnections on IC chips has often been identified as of major importance in the reliability of these devices. The stresses and stress gradients that develop in the conductors as a r
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______325::2650731d39bf4d2b1cb20877db514f30
http://www.escholarship.org/uc/item/8mf0v79p
http://www.escholarship.org/uc/item/8mf0v79p
Autor:
Spolenak, R., Barr, D. L., Gross, M. E., Evans-Lutterodt, K., Brown, W. L., Nobumichi Tamura, Macdowell, A. A., Celestre, R. S., Padmore, H. A., Valek, B. C., Bravman, J. C., Flinn, P., Marieb, T., Keller, R. R., Batterman, B. W., Patel, J. R.
Publikováno v:
Spolenak, Ralph; Barr, D.L.; Gross, M.E.; Evans-Lutterodt, K.; Brown, W.L.; Tamura, N.; et al.(2001). Microtexture and strain in electroplated copper interconnects. Lawrence Berkeley National Laboratory. Lawrence Berkeley National Laboratory: Lawrence Berkeley National Laboratory. Retrieved from: http://www.escholarship.org/uc/item/9z58w046
Scopus-Elsevier
Scopus-Elsevier
The microstructure of narrow metal conductors in the electrical interconnections on IC chips has often been identified as of major importance in the reliability of these devices. The stresses and stress gradients that develop in the conductors as a r
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::5839a29ff88f47929668e5cf75939146
http://www.escholarship.org/uc/item/9z58w046
http://www.escholarship.org/uc/item/9z58w046
Autor:
Bai, P., Auth, C., Balakrishnan, S., Bost, M., Brain, R., Chikarmane, V., Heussner, R., Hussein, M., Hwang, J., Ingerly, D., James, R., Jeong, J., Kenyon, C., Lee, E., Lee, S.-H., Lindert, N., Liu, M., Ma, Z., Marieb, T., Murthy, A.
Publikováno v:
IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004; 2004, p657-660, 4p
Autor:
Spolenak, R., Tamura, N., Valek, B. C., MacDowell, A. A., Celestre, R. S., Padmore, H. A., Brown, W. L., Marieb, T., Batterman, B. W., Patel, J. R.
Publikováno v:
AIP Conference Proceedings; 2002, Vol. 612 Issue 1, p217, 12p, 5 Graphs
Autor:
Chang, Chang-Hwan, Valek, B. C., Padmore, H. A., MacDowell, A. A., Celestre, R., Marieb, T., Bravman, J. C., Koo, Y. M., Patel, J. R.
Publikováno v:
AIP Conference Proceedings; 2000, Vol. 507 Issue 1, p284, 4p
Autor:
Spolenak, R., Barr, D. L., Gross, M. E., Evans-Lutterodt, K., Brown, W. L., Tamura, N., Macdowell, A. A., Celestre, R. S., Padmore, H. A., Valek, B. C., Bravman, J. C., Flinn, P., Marieb, T., Keller, R. R., Batterman, B. W., Patel, J. R.
Publikováno v:
MRS Online Proceedings Library; 2000, Vol. 612 Issue 1, p1-7, 7p
Autor:
Tamura, N., Valek, B. C., Spolenak, R., MacDowell, A. A., Celestre, R. S., Padmore, H. A., Brown, W. L., Marieb, T., Bravman, J. C., Batterman, B. W., Patel, J. R.
Publikováno v:
MRS Online Proceedings Library; 2000, Vol. 612 Issue 1, p1-6, 6p