Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Maria Lepecq"'
Publikováno v:
Sensors, Vol 24, Iss 16, p 5446 (2024)
In modern cyber-physical systems, the integration of AI into vision pipelines is now a standard practice for applications ranging from autonomous vehicles to mobile devices. Traditional AI integration often relies on cloud-based processing, which fac
Externí odkaz:
https://doaj.org/article/7a4d710c128842b9affa6f82aa15b345
Publikováno v:
Sensors, Vol 23, Iss 4, p 1909 (2023)
Three-dimensional-integrated focal-plane array image processor chips offer new opportunities to implement highly parallelised computer vision algorithms directly inside sensors. Neural networks in particular can perform highly complex machine vision
Externí odkaz:
https://doaj.org/article/31f307e82d13419bac596a792ebfff5b
Autor:
Mehdi Darouich, Maria Lepecq
Publikováno v:
ISCAS
Detection, description, and matching of keypoints are commonly used as a first step in embedded real-time vision applications such as tracking, 3D reconstruction, visual odometry, or SLAM. In this paper, we present a hardware accelerator for keypoint
Autor:
Perrine Batude, Olivier Bichler, Laurent Millet, Sebastien Thuries, Alexandre Valentian, Karim Ben Chehida, Maria Lepecq, Monte Alegre, Thomas Dombek, Luis Cubero, Fabien Clermidy, Maxence Bouvier, Cheramy Severine, Pascal Vivet, Gilles Sicard, Stéphane Chevobbe, Didier Lattard
Publikováno v:
DATE
2019 Design, Automation & Test in Europe Conference & Exhibition (DATE)
2019 Design, Automation & Test in Europe Conference & Exhibition (DATE)
Image Sensors will get more and more pervasive into their environment. In the context of Automotive and IoT, low cost image sensors, with high quality pixels, will embed more and more smart functions, such as the regular low level image processing bu
Autor:
Laurent Millet, Lamine Benaissa, Caaliph Andriamisaina, Fabrice Guellec, Edith Beigne, Mehdi Darouich, Marc Duranton, Thomas Dombek, Edouard Deschaseaux, Karim Ben Chehida, Stéphane Chevobbe, Maria Lepecq
Publikováno v:
IEEE Journal of Solid-State Circuits
IEEE Journal of Solid-State Circuits, Institute of Electrical and Electronics Engineers, 2019, 54 (4), pp.1096-1105. ⟨10.1109/JSSC.2018.2886325⟩
IEEE Journal of Solid-State Circuits, 2019, 54 (4), pp.1096-1105. ⟨10.1109/JSSC.2018.2886325⟩
IEEE Journal of Solid-State Circuits, Institute of Electrical and Electronics Engineers, 2019, 54 (4), pp.1096-1105. ⟨10.1109/JSSC.2018.2886325⟩
IEEE Journal of Solid-State Circuits, 2019, 54 (4), pp.1096-1105. ⟨10.1109/JSSC.2018.2886325⟩
This paper presents a 3-D stacked vision chip featuring in-focal-plane read-out tightly coupled with flexible computing architecture for configurable high-speed image analysis. The chip architecture is based on a scalable standalone structure integra
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7cfe9a69ea1285ac176103f138072b1e
https://hal-cea.archives-ouvertes.fr/cea-02186449
https://hal-cea.archives-ouvertes.fr/cea-02186449
Autor:
Maria Lepecq, Karim Ben Chehida, Renaud Schmit, Laurent Soulier, Thomas Dombek, Mickael Guibert, Yann Leclerc, Charly Bechara
Publikováno v:
19th Design, Automation and Test in Europe Conference and Exhibition, DATE 2016
19th Design, Automation and Test in Europe Conference and Exhibition, DATE 2016;, Mar 2016, Dresden, Germany. pp.1022-1023
DATE
19th Design, Automation and Test in Europe Conference and Exhibition, DATE 2016;, Mar 2016, Dresden, Germany. pp.1022-1023
DATE
Conference of 19th Design, Automation and Test in Europe Conference and Exhibition, DATE 2016 ; Conference Date: 14 March 2016 Through 18 March 2016; Conference Code:121520; International audience; The increasing demand for robust and precise navigat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::86bc5e9f5814836cec2e70f3c61b254c
https://hal-cea.archives-ouvertes.fr/cea-01843185
https://hal-cea.archives-ouvertes.fr/cea-01843185