Zobrazeno 1 - 10
of 12
pro vyhledávání: '"Maria Durham"'
Autor:
Kanaka D, Shetty, Michael W, Robbins, Anagha A, Tolpadi, Kyle N, Campbell, Ann M, Clancy, Noni, Bodkin, Maria, Durham, Cheryl L, Damberg
Publikováno v:
The American journal of managed care. 27(12)
CMS measures and reports hospital performance to drive quality improvement (QI), but information on actions that hospitals have taken in response to quality measurement is lacking. We aimed to develop national estimates of QI actions undertaken by ho
Publikováno v:
JAMA. 324(12)
Autor:
Brandon Judd, Maria Durham
Publikováno v:
International Symposium on Microelectronics. 2016:000711-000720
Voiding under bottom terminated components (BTCs), such as quad-flat no-lead (QFN) components, is a problem which many circuit board assembly houses face on a daily basis. Such components have become very popular in circuit board assembly due to many
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2016:001359-001390
The formation of a Ball Grid Array (BGA) solder joint is critical for a BGA package where typically a flux deposition process is used. Reflowing solder spheres to solderable pads on the bottom of substrates in standard BGA, FCBGA, CSP, and similar pa
Autor:
Maria Durham, Brandon Judd
Publikováno v:
International Symposium on Microelectronics. 2015:000827-000832
The use of bottom terminated components (BTCs) such as quad-flat no-leads (QFNs) has become commonplace in the circuit board assembly world. This package offers several benefits including its small form factor, its excellent thermal and electrical pe
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2015:001475-001501
Copper pillars topped with solder microbumps are emerging as a standard flip-chip solder bump replacement in the semiconductor assembly industry. The relentless drive towards finer pitch, combined with reduced copper pillar height, makes aqueous clea
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2014:000913-000929
The final step of reflowing solder spheres to solderable pads on the bottom of substrates in FCBGA, CSP, and WLCSP packages is often considered to be a trivial step. However, with the increasing complexity and number of assembly processes taken prior
Publikováno v:
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
A ball grid array (BGA) is a type of surface-mount package used for integrated circuits. In more advanced technologies, solder balls may be used on both the PCB and the package. Also, in stacked multi-chip modules, solder balls are used to connect tw
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2013:000811-000840
Spin-coating is an important processing technique used in several industries, whereby a centrifugal force is used to produce a uniform thickness of fluid material on a rotating surface. In particular, spin-coating is being used throughout the electro
Publikováno v:
2016 China Semiconductor Technology International Conference (CSTIC).
Assembly process for most packages involves using some form of soldering material, either fluxes or solder pastes, to create a reliable solder joints. Flux, which is also part of the constituent of solder paste, is needed to remove the oxides from th