Zobrazeno 1 - 10 of 12 pro vyhledávání: '"Maria Tijero"'
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Smart access to small lot manufacturing for systems integration
Autor: Yineng Wang, Dag Andersson, Guy Voirin, Heike Wünscher, Arndt Steinke, Hans Gronqvist, Rainer Gunzler, Stephan Karmann, Eric Moore, Sophie Billat, Petra Weiler, Marco Belcastro, Maria Tijero, Andreas Albrecht, Xi Cao, Patricia Vazquez, Thomas Frank, Anna Hogan, K Mayora
Publikováno v: 2018 Pan Pacific Microelectronics Symposium (Pan Pacific).
The three year EU project SMARTER-SI that ends in January 2018 has tested a new concept for small lot manufacturing for SMEs which we call the Cooperative Foundry Model (CFM). During previous research, all RTOs have completed building blocks, i.e. co
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::fc2fe7aa21d636525385d2be223bc3db
https://doi.org/10.23919/panpacific.2018.8319009
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3
Development of a lab-on-chip electrochemical immunosensor for detection of Polycyclic Aromatic Hydrocarbons (PAH) in environmental water
Autor: Jan Dehnert, Vadim Goridko, Patricia Vazquez, Shifa Felemban, Eric Moore, Maria Tijero
Publikováno v: SPIE Proceedings.
The work described in this manuscript focuses on how the integration of immunoassay techniques in combination with electrochemical detection can provide a portable and very accurate solution for detection of water pollutants that are detrimental for
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::2609dda17554ae357d15b69be8516ce2
https://doi.org/10.1117/12.2265011
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4
Novel three-dimensional embedded SU-8 microchannels fabricated using a low temperature full wafer adhesive bonding
Autor: Maria Tijero, Francisco J. Blanco, Jesús Ruano, Javier Berganzo, M.T. Arroyo, J. Garcia, K Mayora, Inigo Aramburu, Maria Agirregabiria
Publikováno v: Journal of Micromechanics and Microengineering. 14:1047-1056
This paper describes a novel fabrication method for the manufacture of three-dimensional (3D) interconnected microchannels. The fabrication is based on a full wafer polymer bonding process, using SU-8 polymer epoxy photoresist as a structural materia
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::f7f42a67588409a86eb929783a4fd611
https://doi.org/10.1088/0960-1317/14/7/027
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