Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Marek Chnapko"'
Publikováno v:
Scientific Reports, Vol 13, Iss 1, Pp 1-14 (2023)
Abstract Reliability and lifetime of specific electronics boards depends on the quality of manufacturing process. Especially soldering splashes in some areas of PCB (printed circuit board) can cause change of selected electrical parameters. Nowadays,
Externí odkaz:
https://doaj.org/article/33c07d0fe612402eb7f0ef3f53f51798
Autor:
Dušan Koniar, Peter Klčo, Libor Hargaš, Marek Chnápko, Katarína Pocisková Dimová, Vladimír Kindl
Publikováno v:
Communications, Vol 25, Iss 2, Pp C36-C47 (2023)
This study discusses the automated visual inspection of electronic boards used in the mass production of power electronics equipment. Soldering splashes, produced during the necessary manufacturing stages, can affect the hybrid power semiconductor mo
Externí odkaz:
https://doaj.org/article/30f104898dd647e0923582680be1cc52