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Autor:
Dušan Koniar, Peter Klčo, Libor Hargaš, Marek Chnápko, Katarína Pocisková Dimová, Vladimír Kindl
Publikováno v:
Communications, Vol 25, Iss 2, Pp C36-C47 (2023)
This study discusses the automated visual inspection of electronic boards used in the mass production of power electronics equipment. Soldering splashes, produced during the necessary manufacturing stages, can affect the hybrid power semiconductor mo
Externí odkaz:
https://doaj.org/article/30f104898dd647e0923582680be1cc52
