Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Marek Šikula"'
Publikováno v:
International Symposium for Testing and Failure Analysis.
A protocol for obtaining an advanced TEM lamella geometry using FIB-SEM is presented. Lamella lift-out procedure might require multiple manipulation steps or even breaking the vacuum in order to reach inverted or plan-view lamella geometries. We have
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5f8e48343a28aa6e7984c7cec44b2f43
https://doi.org/10.31399/asm.cp.istfa2020p0141
https://doi.org/10.31399/asm.cp.istfa2020p0141
Publikováno v:
International Symposium for Testing and Failure Analysis.
Multipurpose sample holder for advanced Transmission Electron Microscopy (TEM) sample preparation which reduces cost of the tool and most importantly simplifies the workflow is introduced. Following the current demand for user-friendly interface, sem
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::31e8601ec5d33af03990240a9523fa3f
https://doi.org/10.31399/asm.cp.istfa2019p0219
https://doi.org/10.31399/asm.cp.istfa2019p0219
Publikováno v:
Microscopy and Microanalysis. 26:1980-1981
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7baa15775c44d99ba0bca83f853bb3b8
https://doi.org/10.1017/s1431927620020012
https://doi.org/10.1017/s1431927620020012
Publikováno v:
International Symposium for Testing and Failure Analysis.
An advanced sample preparation protocol using Xe+ Plasma FIB for increasing FA throughput is proposed. We prepared cross-sections of 400 μm and wider in challenging samples such as a BGA (CSP), bond wires in mold compound or a TSV array. These often
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5fb2604052ad7943f926c6ddfd2f442a
https://doi.org/10.31399/asm.cp.istfa2017p0270
https://doi.org/10.31399/asm.cp.istfa2017p0270
Publikováno v:
2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
An advanced sample preparation protocol using Xe+ Plasma FIB for cross-sections wider than 400 μm is proposed. Challenging samples such as a BGA (CSP) or chip in a package often suffer from FIB milling artifacts. The results are unsatisfactory mainl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bc63d5e2982e2cfbb9f2f0e207f0d4e8
https://doi.org/10.1109/ipfa.2017.8060168
https://doi.org/10.1109/ipfa.2017.8060168
Publikováno v:
International Symposium for Testing and Failure Analysis.
High speed FIB cross-sectioning of polyimide material was traditionally very difficult because of artifacts created by FIB on the cross section plane. Therefore we propose a simple method, which retains the high speed of the FIB process, but signific
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d77c8c8685efb15d6a237aa6efd1420e
https://doi.org/10.31399/asm.cp.istfa2016p0630
https://doi.org/10.31399/asm.cp.istfa2016p0630
Publikováno v:
Microscopy and Microanalysis. 22:56-57
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6378f52ca6a8c8a7f826c6aefa5ef3d9
https://doi.org/10.1017/s1431927616001136
https://doi.org/10.1017/s1431927616001136