Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Marcus Louwerse"'
Publikováno v:
Micromachines, Vol 12, Iss 4, p 414 (2021)
Several Silicon on Insulator (SOI) wafer manufacturers are now offering products with customer-defined cavities etched in the handle wafer, which significantly simplifies the fabrication of MEMS devices such as pressure sensors. This paper presents a
Externí odkaz:
https://doaj.org/article/f3dc54066ccf491b82c23ad6755919ee
Autor:
Angel Savov, Shivani Joshi, Salman Shafqat, Johan Hoefnagels, Marcus Louwerse, Ronald Stoute, Ronald Dekker
Publikováno v:
Micromachines, Vol 9, Iss 1, p 39 (2018)
A device for studying the mechanical and electrical behavior of free-standing micro-fabricated metal structures, subjected to a very large deformation, is presented in this paper. The free-standing structures are intended to serve as interconnects in
Externí odkaz:
https://doaj.org/article/fe39c0ecb0b84578a8dbee21dfe0186d
Autor:
Jian Li, Chenhui Li, Vincent Henneken, Marcus Louwerse, Jeannet van Rens, Paul Dijkstra, Oded Raz, Ronald Dekker
Publikováno v:
Journal of Lightwave Technology, 40(8):9662251, 2456-2464. IEEE/LEOS
Journal of Lightwave Technology, 40(8)
Journal of Lightwave Technology, 40(8)
The digitization of smart catheters will dramatically increase the demand for reliable and high data transmission in the distal tips. Optical fiber is a good candidate to provide high-speed data transmission. However, the extremely small scale of the
Publikováno v:
International Symposium on Microelectronics. 2020:000169-000173
We demonstrate a stand-alone optical data link module (ODLM) that fits in the limited space budget of smart imaging catheters. The module is based on an extension of the Flex-to-Rigid (F2R) technology platform for miniaturized system integration. The
Publikováno v:
Micromachines
Volume 12
Issue 4
Micromachines, Vol 12, Iss 414, p 414 (2021)
Micromachines, 12(4)
Volume 12
Issue 4
Micromachines, Vol 12, Iss 414, p 414 (2021)
Micromachines, 12(4)
Several Silicon on Insulator (SOI) wafer manufacturers are now offering products with customer-defined cavities etched in the handle wafer, which significantly simplifies the fabrication of MEMS devices such as pressure sensors. This paper presents a
Autor:
Ronald Dekker, Marcus Louwerse, Jeroen Naaborg, Vincent Adrianus Henneken, Carlo Eugeni, Jian Li
Publikováno v:
Proceedings-2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020
Our work presents embedded high-density oxide-nitride-oxide (ONO) trench capacitors for power supply decoupling in the next generation of smart catheters. These millimeter-scale smart catheters are using a novel integration platform, Flex-to-Rigid (F
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3be2df7ea72facd506d2aec396a7bea1
http://resolver.tudelft.nl/uuid:3845db1d-20c7-4a74-a547-4c2bde528b18
http://resolver.tudelft.nl/uuid:3845db1d-20c7-4a74-a547-4c2bde528b18
Autor:
Ronald Dekker, Marcus Louwerse, Vincent Adrianus Henneken, Vasiliki Giagka, C. van Heesch, M. de Haas, Shinnosuke Kawasaki
Publikováno v:
NER
2019 9th International IEEE/EMBS Conference on Neural Engineering
2019 9th International IEEE/EMBS Conference on Neural Engineering
Vagus nerve stimulators currently on the market can treat epilepsy and depression. Recent clinical trials show the potential for vagus nerve stimulation (VNS) to treat epilepsy, autoimmune disease, and traumatic brain injury. As we explore the benefi
Autor:
Marcus Louwerse, Angel Savov, Shivani Joshi, Ronald Stoute, Salman Shafqat, Johan P.M. Hoefnagels, Ronald Dekker
Publikováno v:
Micromachines, 9(1)
Micromachines, 9(1):39. Multidisciplinary Digital Publishing Institute (MDPI)
Micromachines, Vol 9, Iss 1, p 39 (2018)
Micromachines
Micromachines; Volume 9; Issue 1; Pages: 39
Micromachines, 9(1):39. Multidisciplinary Digital Publishing Institute (MDPI)
Micromachines, Vol 9, Iss 1, p 39 (2018)
Micromachines
Micromachines; Volume 9; Issue 1; Pages: 39
A device for studying the mechanical and electrical behavior of free-standing microfabricated metal structures, subjected to a very large deformation, is presented in this paper. The free-standing structures are intended to serve as interconnects in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::37c7029b133471238d844dabe6ad4a40
http://resolver.tudelft.nl/uuid:1b75e581-cfb7-4cd9-938d-a316617bb49b
http://resolver.tudelft.nl/uuid:1b75e581-cfb7-4cd9-938d-a316617bb49b