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Publikováno v:
Materials Testing. 46:513-516
In-situ SEM and XRM studies of fully embedded via/line interconnect structures allow imaging of the time-dependent void evolution in inlaid copper interconnects. It is shown that void formation, growth and movement, and consequently degradation, depe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d9e5d3ae5b24be28d9f90d9deb809202
https://doi.org/10.3139/120.100619
https://doi.org/10.3139/120.100619
