Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Marcel Wall"'
Autor:
Yi Yang, Marcel Wall, Rengarajan Shanmugam, Sarah Wozny, Xin Yan, Mohit Khurana, Rajeev Ranjan, Dilan Seneviratne, Kassandra Nikkhah, Suddhasattwa Nad
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d2facb723d5b397ecda937620a59ca77
https://doi.org/10.1109/ectc51906.2022.00109
https://doi.org/10.1109/ectc51906.2022.00109
Autor:
Kousik Ganesan, Rahul Manepalli, Marcel Wall, Andrew Wentzel, Helme Castro, Wencaho Li, Thomas Heaton
Publikováno v:
ECS Meeting Abstracts. :1250-1250
Low cost electroplating of copper to create Fine Line Space (FLS) features and Blind Micro Via’s (BMV) is a key technology element of high density substrates for integrated circuit packaging. In this work, we demonstrate a capable deposition method
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::afe59f44bfce065e645c8aa096fb316d
https://doi.org/10.1149/ma2019-02/28/1250
https://doi.org/10.1149/ma2019-02/28/1250