Zobrazeno 1 - 10
of 21
pro vyhledávání: '"Marcel Hornaff"'
Autor:
Mariia Kepper, Andreas Tünnermann, Erik Beckert, Isabelle Toubhans, Ramona Eberhardt, Francis Descours, Marcel Hornaff, Eddie Prevost
Publikováno v:
Photonic Instrumentation Engineering VII.
A laser based soldering technique – Solderjet Bumping – using liquid solder droplets in a flux-free process with localized thermal impact demonstrates the all inorganic, adhesive free attachment of optical components and support structures made o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7b285f1eec68ef924dd1c6f6bdc07416
https://doi.org/10.1117/12.2543679
https://doi.org/10.1117/12.2543679
Autor:
Francis Descours, Isabelle Toubhans, Pascal Pranyies, Marcel Hornaff, Ramona Eberhardt, Pol Ribes-Pleguezuelo, Andreas Tünnermann, Mariia Kepper, Erik Beckert
Publikováno v:
PHOTOPTICS
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ba826d1225da76fd47a4d5255a72ae09
https://doi.org/10.5220/0007525100850093
https://doi.org/10.5220/0007525100850093
Publikováno v:
Physics Procedia. 83:540-548
A deformable mirror (DM) is a device that aims to compensate laser-induced mirror deformation and thermal lensing in the optical system. The mounting of membrane based DM with screen-printed actuators is crucial, as stress may deform the membrane and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::efc44836aa19966a432d2a182f3ea745
Autor:
G. Fiault, Pol Ribes-Pleguezuelo, Charlie Koechlin, Erik Beckert, S. Gramens, Marcel Hornaff, Ramona Eberhardt, Thomas Burkhardt, Andreas Kamm, Andreas Tünnermann
Publikováno v:
International Conference on Space Optics — ICSO 2016.
A high-precision opto-mechanical breadboard for a lens mount has been assembled by means of a laserbased soldering process called Solderjet Bumping; which thanks to its localized and minimized input of thermal energy, is well suited for the joining o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dd4c49ef07547f7b62287e487966232f
https://doi.org/10.1117/12.2296074
https://doi.org/10.1117/12.2296074
Autor:
Christoph Damm, Thomas Burkhardt, Erik Beckert, Oliver de Vries, Marcel Hornaff, Jan Kinast, Max Mäusezahl
Publikováno v:
High-Power Laser Materials Processing: Applications, Diagnostics, and Systems VI.
Solder joining is an all inorganic, adhesive free bonding technique for optical components and support structures of advanced optical systems. We established laser-based Solderjet Bumping for mounting and joining of elements with highest accuracies a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fb9ac202e4f9e2379bd7247ed947356a
https://doi.org/10.1117/12.2254752
https://doi.org/10.1117/12.2254752
Autor:
Erik Beckert, D. Burkhardt, Ramona Eberhardt, Andreas Tünnermann, Marcel Hornaff, Thomas Burkhardt, Andreas Kamm
Publikováno v:
SPIE Proceedings.
Advanced optical systems of telescopes and scientific instrumentation require high accuracy mounting and joining of components. Applications for deep UV, under high energetic radiation, for vacuum operation, or assemblies subjected to environmental l
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::35e7de0c26edebde3dff86fe49d902a5
https://doi.org/10.1117/12.2232486
https://doi.org/10.1117/12.2232486
Autor:
Charlie Koechlin, S. Gramens, R. Eberhardt, Erik Beckert, Marcel Hornaff, G. Fiault, P. Ribes, D. Burkhardt, Thomas Burkhardt, Andreas Kamm, Andreas Tünnermann
Publikováno v:
Integrated Optics: Devices, Materials, and Technologies XX.
Solder joining using metallic solder alloys is an alternative to adhesive bonding. Laser-based soldering processes are especially well suited for the joining of optical components made of fragile and brittle materials such as glasses, ceramics and op
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6e65aa576e50a4501fa27c2aaee9117e
https://doi.org/10.1117/12.2208123
https://doi.org/10.1117/12.2208123
Micro-optical packaging methods using laser-based Solderjet Bumping are a versatile alternative to established adhesive bonding, featuring the advantages of metallic solder in optical systems. Yet, aging properties have often been studied only for ce
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b58c4da93694971400d6a6a43ef25c3f
https://publica.fraunhofer.de/handle/publica/248673
https://publica.fraunhofer.de/handle/publica/248673
Autor:
Marcel Hornaff, Thomas Burkhardt, Erik Beckert, Thomas Peschel, K.-H. Suphan, A. Acker, Ramona Eberhardt, S. Jirak, Andreas Tünnermann, K. Mensel
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2012:000238-000245
A high power ultraviolet (UV) light emitting diode (LED) multi-chip module package based on aluminum nitride (AlN) and alumina (Al2O3) is presented. The AlN substrate with a high thermal conductivity of up to 180 W/(m· K) and LED chips based on a co
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a1fd2eb615bda896d40476cacbc43846
https://doi.org/10.4071/cicmt-2012-tp61
https://doi.org/10.4071/cicmt-2012-tp61
Autor:
E. Beckert, K. Mensel, Marcel Hornaff, A. Tünnermann, Thomas Peschel, K.-H. Suphan, A. Acker, R. Eberhardt, S. Jirak, Thomas Burkhardt
Publikováno v:
Scopus-Elsevier
A high power UV light emitting diode (LED) multichip module package based on aluminum nitride (AlN) and alumina (Al2O3) is presented. The AlN substrate with a high thermal conductivity of up to 180 W/(m·K) and LED chips based on a copper alloy provi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::daa80a44cb79031eda4fb1ea1b68850b
https://doi.org/10.4071/imaps.334
https://doi.org/10.4071/imaps.334