Zobrazeno 1 - 10
of 11
pro vyhledávání: '"Marc Schaepkens"'
Autor:
Jie Liu, Marc Schaepkens, Matthew A. Pellow, Min Yan, Paul Alan Mcconnelee, Donald Franklin Foust, Thomas Paul Feist, Tae Won Kim, Christian Maria Anton Heller, Anil Raj Duggal, Ahmet Gun Erlat
Publikováno v:
Proceedings of the IEEE. 93:1468-1477
The use of plastic film substrates for organic electronic devices promises to enable new applications, such as flexible displays and conformal lighting, and a new low-cost paradigm through high-volume roll-to-roll fabrication. Unfortunately, presentl
Autor:
Anil Raj Duggal, Marc Schaepkens, Tae Won Kim, Min Yan, John Deluca, Ahmet Gun Erlat, Mathew Pellow, Paul Alan Mcconnelee, Thomas Paul Feist
Publikováno v:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 23:971-977
We have developed a coating technology to reduce the moisture permeation rate through a polycarbonate plastic film substrate to below 1×10−5g∕m2∕day using plasma-enhanced chemical vapor deposition. Unlike other ultrahigh barrier (UHB) coatings
Autor:
Ahmet Gun Erlat, Marc Schaepkens, Christian Maria Anton Heller, Kevin Warner Flanagan, Min Yan, Tae Won Kim, Paul Alan Mcconnelee
Publikováno v:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 22:1716-1722
The use of polycarbonate film substrates enables fabrication of applications, such as flexible display devices, lighting devices, and other flexible electro-optical devices, using low cost, roll-to-roll fabrication technologies. One of the limitation
Publikováno v:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 21:1971-1977
A quadrupole mass spectrometer equipped with a special sampling tube and positioned on a linear-motion table is shown to be capable of obtaining important information on the variation of the discharge properties with position. We measured signals obt
Autor:
Louis C. Frees, Marc Schaepkens, Norbert Mueller, Xi Li, Norman Korner, Robert E. Ellefson, Gottlieb S. Oehrlein
Publikováno v:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 17:2438-2446
Positive ions and radicals in C2F6 and CHF3 high density discharges were measured using a direct-line-of-sight mass spectrometer. The ion energy distributions of the dominant ions were measured as a function of process conditions. Appearance potentia
Publikováno v:
Scopus-Elsevier
In the fabrication of microstructures in SiO2, etch selectivity of SiO2 to masking, etch stop, and underlayer materials need to be maintained at corners and inclined surfaces. The angular dependence of the SiO2-to-Si3N4 etch selectivity mechanism in
Autor:
Marc Schaepkens, Gottlieb S. Oehrlein
Publikováno v:
ChemInform. 32
A comprehensive overview of results from mechanistic studies on plasma-surface interactions in inductively coupled fluorocarbon plasmas, which are currently widely used for the SiO 2 etching process in semiconductor device manufacturing industry, is
Autor:
Gottlieb S. Oehrlein, Marc Schaepkens
Publikováno v:
Applied Physics Letters. 72:1293-1295
When fabricating microscopic features in SiO2 layers using low pressure, high-density fluorocarbon plasmas, microtrenching has commonly been observed. Microtrenching has been explained either as due to ion scattering from sloped sidewalls or negative
Autor:
M Marc Schaepkens, RJ René Severens, van de Mcm Richard Sanden, Hjm Eric Verhoeven, DC Daan Schram
Publikováno v:
Review of Scientific Instruments, 67(10), 3624-3626. American Institute of Physics
A method to determine the electrical conductance of thin films such as a‐Si:H that does not require contacting electrodes is presented. This method, introduced by Sommer and Tanner, is based on measuring the phase shift of a capacitive transmission
Autor:
DC Daan Schram, M Marc Schaepkens, van de Mcm Richard Sanden, Gjh Seth Brussaard, Kgy Karine Letourneur
Publikováno v:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 21:61
Photoresist is etched using a remote thermal (cascaded arc) plasma in Ar/O2 and Ar/O2N2 mixtures. Very high etch rates, up to 200 nm/s, are achieved at low substrate temperatures (350 K) and low electron and ion temperatures (