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Fabrication and Optimization of High Frequency ZnO Transducers for Both Longitudinal and Shear Emission: Application of Viscosity Measurement using Ultrasound

Autor: Vincent Thomy, Bertrand Nongaillard, Malika Toubal, Pierre Campistron, Souad Harmand, Julien Carlier, Ibrahim Zaaroura, Abbas Ramez Salhab, Hatem Dahmani, Marc Neyens

Publikováno v: Advances in Science, Technology and Engineering Systems Journal
Advances in Science, Technology and Engineering Systems Journal, 2020, 5 (6), pp.1428-1435. ⟨10.25046/aj0506173⟩
Advances in Science, Technology and Engineering Systems Journal, Advances in Science Technology and Engineering Systems Journal (ASTESJ), 2020, 5 (6), pp.1428-1435. ⟨10.25046/aj0506173⟩

International audience; This paper covers the study of high-frequency (~ 1 GHz) ZnO piezoelectric transducer integrated on a silicon substrate able to generate both compressional and shear acoustic waves. First, to promote the longitudinal mode, an e

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::eb8c40425d98f5af7d5d0ec46fa8b3a5
https://doi.org/10.25046/aj0506173

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Polydimethylsiloxane micro-channels application for the study of dynamic wetting of nano-etched silicon surfaces based on acoustic characterization method

Autor: Marc Neyens, Vincent Thomy, Malika Toubal, Bertrand Nongaillard, Abbas Ramez Salhab, Pierre Campistron, Julien Carlier

Publikováno v: 15th International Symposium on Ultra Clean Processing of Semiconductor Surfaces, UCPSS 2021, Session 6-Wet processing in narrow spaces and pattern collapse
15th International Symposium on Ultra Clean Processing of Semiconductor Surfaces, UCPSS 2021, Session 6-Wet processing in narrow spaces and pattern collapse, Apr 2021, Virtual, Unknown Region. pp.143-149, ⟨10.4028/www.scientific.net/SSP.314.143⟩

ORAL; International audience; Efficient cleaning of contaminations in the semiconductor industry is a determining factor in ensuring the good quality of the electronics products. We present here the dynamic wetting characterization of a fluid on top

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7c23abd0993787c33af5ae7e1f994c28
https://hal.archives-ouvertes.fr/hal-03362264/document

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Chemical Infiltration through Deep UV Photoresist

Autor: Marc Neyens, Philippe Garnier

Publikováno v: Solid State Phenomena. 255:117-121

Still nowadays in integrated circuits manufacturing, few materials patterns are defined by a wet etch on patterned deep UV photoresist. From dies to dies generation, an optical performance improvement is required, hence an evolution with thinner and

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::d05d7c38d364b83253fab2de16fb789a
https://doi.org/10.4028/www.scientific.net/ssp.255.117

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Acoustic Characterization of Patterning Degradation during Wet Etching

Autor: Christophe Virgilio, Marc Neyens, David Pinceau, Julien Carlier, Philippe Garnier, Lucile Broussous, Bertrand Nongaillard, Mathieu Foucaud, Pierre Campistron, Arnaud Devos

Publikováno v: ECS Transactions
ECS Transactions, 2015, 69 (8), pp.185-190. ⟨10.1149/06908.0185ecst⟩

Wet etching in photoresist presence is commonly used in MEMS or integrated circuits manufacturing: metal gates [1], or gate oxides patterning [2]. Nonetheless the resist can’t stand a too long exposure to wet chemicals. Indeed, the liquids diffuse

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::44d3675aa7bd1db8a3cd9c116a46b3e9
https://doi.org/10.1149/06908.0185ecst

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Wet Etchant Diffusion through Photoresist during Gate Oxide Patterning

Autor: Christophe Licitra, Nevine Rochat, Philippe Garnier, Raluca Tiron, Marc Neyens, Manon Garach

Publikováno v: ECS Transactions. 69:177-183

Gate oxide patterning during integrated circuits manufacturing is defined by a photolithography – etch sequence. Wet etchants are still preferred to plasma to keep smooth transistors channel. With the transistor nodes evolution, not only the latera

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a9c456d2bfe3a5c2930b69cdc757ba89
https://doi.org/10.1149/06908.0177ecst

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Caractérisation dynamique de l'état de mouillage et de séchage de structures DTI(Deep Trench Isolation) par ondes ultrasonores haute fréquence

Autor: Salhab, Abbas

Publikováno v: Micro and nanotechnologies/Microelectronics. Université Polytechnique Hauts-de-France, 2022. English. ⟨NNT : 2022UPHF0008⟩

In the semiconductor industry, effective wet cleaning of contamination is a critical factor in ensuring good quality of electronic products. The cycle between the wetting and drying processes can create several problems in the high aspect ratio micro

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=od______4254::36d1e3561c7a00d2dc7ce5b4d71cbafb
https://theses.hal.science/tel-03663964

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