Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Marc Nelis"'
Autor:
Vladimir Cherman, Steven Thijs, Wouter Ruythooren, Dimitri Linten, Dimitrios Velenis, I. De Wolf, J. Van Olmen, Paresh Limaye, Riet Labie, M. de Potter de ten Broeck, Morin Dehan, V. Simons, Michal Rakowski, Wim Dehaene, Antonio Pullini, Herman Oprins, Igor Loi, Miro Cupac, D. Perry, G. Katti, Marc Nelis, G. Van der Plas, Youssef Travaly, Federico Angiolini, Abdelkarim Mercha, C. Torregiani, N. Minas, Alain Phommahaxay, A. Opdebeeck, Eric Beyne, Rahul Agarwal, Pol Marchal, Michele Stucchi, S Bronckers, B. De Wachter, Luca Benini, Bart Vandevelde
Publikováno v:
ISSCC
In this paper key design issues and considerations of a low-cost 3-D Cu-TSV technology are investigated. The impact of TSV on BEOL interconnect reliability is limited, no failures have been observed. The impact of TSV stress on MOS devices causes shi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d5977e2f158201f29c9dfb9475ff5464
http://hdl.handle.net/11585/106158
http://hdl.handle.net/11585/106158
Autor:
Dimitri Linten, Miro Cupac, Paresh Limaye, Morin Dehan, Steven Thijs, Rahul Agarwal, Geert Van der Plas, G. Katti, Bart Vandevelde, Paul Marchal, Michele Stucchi, Herman Oprins, Eric Beyne, Youssef Travaly, N. Minas, Wim Dehaene, Abdelkarim Mercha, Marc Nelis
Publikováno v:
CICC
We describe the design challenges for a low-cost 130nm 3D CMOS technology with 5µm diameter at 10µm pitch Cu-TSV. We investigate electrical, thermal and thermo-mechanical issues encountered in 3D. The electrical yield and ESD of TSVs is reviewed an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4c7ffdc1317dde6b59384a15d1bfc6a1
https://doi.org/10.1109/cicc.2010.5617425
https://doi.org/10.1109/cicc.2010.5617425
Autor:
Geert Van der Plas, Paresh Limaye, Abdelkarim Mercha, Herman Oprins, Cristina Torregiani, Steven Thijs, Dimitri Linten, Michele Stucchi, Katti Guruprasad, Dimitrios Velenis, Domae Shinichi, Vladimir Cherman, Bart Vandevelde, Veerle Simons, Ingrid De Wolf, Riet Labie, Dan Perry, Stephane Bronckers, Nikolas Minas, Miro Cupac, Wouter Ruythooren, Jan Van Olmen, Alain Phommahaxay, Muriel de Potter de ten Broeck, Ann Opdebeeck, Michal Rakowski, Bart De Wachter, Morin Dehan, Marc Nelis, Rahul Agarwal, Wim Dehaene, Youssef Travaly, Pol Marchal, Eric Beyne
Publikováno v:
2010 IEEE International Solid-State Circuits Conference - (ISSCC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1906204f67f343416668e52febbcd5dd
https://doi.org/10.1109/isscc.2010.5434016
https://doi.org/10.1109/isscc.2010.5434016
Autor:
Bart Vandevelde, Paul Marchal, Steven Thijs, Abdelkarim Mercha, Stephane Bronckers, Dimitri Linten, Katti Guruprasad, Wim Dehaene, Youssef Travaly, Paresh Limaye, Marc Nelis, N. Minas, Morin Dehan, Miro Cupac, Geert Van der Plas, Michele Stucchi, Rahul Agarwal, Eric Beyne
Publikováno v:
Proceedings of 2010 International Symposium on VLSI Technology, System and Application.
The paper describes the design challenges for a low-cost 3D Cu-TSV technology. Based on experimental characterization, we'll indicate the importance of thermal and thermo-mechanical challenges. To avoid related yield loss and/or reliability issues, t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d36823ba4b171cdb799b5d99c57858c5
https://doi.org/10.1109/vtsa.2010.5488929
https://doi.org/10.1109/vtsa.2010.5488929
Akademický článek
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
K zobrazení výsledku je třeba se přihlásit.
Akademický článek
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
K zobrazení výsledku je třeba se přihlásit.