Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Marc Berardi"'
Autor:
Akshit Patel, Trevor Junquera, Kun Yu, Sridhar Kuchibhatla, Nirmal Sundaramoorthy, Harith Sethupathi, Samuel Marble, Casey Biederman, Brett Yatzor, Brian O'Hara, Justin Clements, Chris Torcedo, Marc Berardi, Elizabeth Sunkel, Daniel Costello, Tyler Reynolds, Michael Hatzistergos, Vincent Sih, Bradley Morgenfield, Olugbenga Famodu
Publikováno v:
2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::090c11c3d9ea4b58b790526b9fd6396c
https://doi.org/10.1109/asmc57536.2023.10121068
https://doi.org/10.1109/asmc57536.2023.10121068
Autor:
Stephan Grunow, Balasubramanian S. Haran, Zeynel Bayindir, Joseph F. Shepard, Jinping Liu, Brett Yatzor, Han Tao, Sanjay Mehta, Marc Berardi, Haifeng Sheng, Rishikesh Krishnan
Publikováno v:
ECS Transactions. 85:717-728
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8dfa5611d181ced6b471f8ca7129417b
https://doi.org/10.1149/08513.0717ecst
https://doi.org/10.1149/08513.0717ecst
Autor:
Sanjay Mehta, Haifeng Sheng, Rishikesh Krishnan, Bala Haran, Tao Han, Marc Berardi, Zeynel Bayndir, Brett Yatzor, Jinping Liu, Joseph Shepard, Stephan Grunow
Publikováno v:
ECS Meeting Abstracts. :1183-1183
As device dimensions scale, defect-free, robust gap filling in high aspect ratio structures such as STI and inter-gate spaces becomes increasingly challenging. This is due to very high aspect ratio (AR) of gap fill structure (AR > 7:1), shrinking CDs
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fc7aec0fd48ea29c5f805a2d0a1617b6
https://doi.org/10.1149/ma2018-01/17/1183
https://doi.org/10.1149/ma2018-01/17/1183