Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Mao Xiang Yi"'
Publikováno v:
Applied Mechanics and Materials. :231-235
To reduce the test time and test cost of 3-D ICs, this paper proposed a design method of building three-dimensional scan tree, which can optimize the number of through silicon via (TSV) when limit the leaf nodes number. The proposed technique partiti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b14c2f8aa9bb3f6c8fc771991eea4fbb
https://doi.org/10.4028/www.scientific.net/amm.701-702.231
https://doi.org/10.4028/www.scientific.net/amm.701-702.231
Publikováno v:
Applied Mechanics and Materials. 529:359-363
A novel concurrent core test approach is proposed to reduce the test cost of SoC. Before test, a novel test set sharing strategy is proposed to obtain a minimum size of merged test set by merging the test sets corresponding to cores under test (CUT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d23e150fec541d8192c3590d55eac68a
https://doi.org/10.4028/www.scientific.net/amm.529.359
https://doi.org/10.4028/www.scientific.net/amm.529.359
Autor:
Zheng Feng Huang, Mao Xiang Yi
Publikováno v:
Applied Mechanics and Materials. :4228-4231
This paper presents a built-in SEU sensor (BISS) to detect soft errors in CMOS digital systems. BISS detects SEU-induced soft errors by monitoring the meta-stability in the flip-flops. BISS includes positive pulse generator, footed dynamic inverter a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::27e303097a80070dc3c9690b986a4c7b
https://doi.org/10.4028/www.scientific.net/amm.130-134.4228
https://doi.org/10.4028/www.scientific.net/amm.130-134.4228