Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Manuel Kollmuß"'
Autor:
Gaetano Calogero, Ioannis Deretzis, Giuseppe Fisicaro, Manuel Kollmuß, Francesco La Via, Salvatore F. Lombardo, Michael Schöler, Peter J. Wellmann, Antonino La Magna
Publikováno v:
Crystals, Vol 12, Iss 12, p 1701 (2022)
Multiscale approaches for the simulation of materials processing are becoming essential to the industrialization of future nanotechnologies, as they allow for a reduction in production costs and an enhancement of devices and applications. Their integ
Externí odkaz:
https://doaj.org/article/fe6781160b474a6598370251a66ff35a
Publikováno v:
Crystal Research and Technology.
Autor:
Manuel Kollmuss, Michael Schöler, Ruggero Anzalone, Marco Mauceri, Francesco La Via, Peter J. Wellmann
Publikováno v:
Materials Science Forum. 1062:74-78
One setback that hinders the breakthrough of cubic silicon carbide is the lack of suitable seeding material for sublimation growth methods such as PVT. We present the growth of large area cubic silicon carbide material, up to a diameter of 100 mm, wi
Autor:
Manuel Kollmuss, Johannes Köhler, Hai Yan Ou, Wei Chen Fan, Didier Chaussende, Rainer Hock, Peter J. Wellmann
Publikováno v:
Materials Science Forum. 1062:119-124
3C-SiC films have been grown on [100] n-doped Si substrates in a horizontal cold wall CVD reactor. Without the use of plasma enhancement, the precursors silane and propane are used to deposit silicon carbide films at T < 1200°C. The structure of the
Autor:
Haiyan Ou, Xiaodong Shi, Yaoqin Lu, Manuel Kollmuss, Johannes Steiner, Vincent Tabouret, Mikael Syväjärvi, Peter Wellmann, Didier Chaussende
Publikováno v:
Materials
Materials, 2023, 16 (3), pp.1014. ⟨10.3390/ma16031014⟩
Ou, H, Shi, X, Lu, Y, Kollmuss, M, Steiner, J, Tabouret, V, Syväjärvi, M, Wellmann, P & Chaussende, D 2023, ' Novel Photonic Applications of Silicon Carbide ', Materials, vol. 16, no. 3, 1014 . https://doi.org/10.3390/ma16031014
Materials, 2023, 16 (3), pp.1014. ⟨10.3390/ma16031014⟩
Ou, H, Shi, X, Lu, Y, Kollmuss, M, Steiner, J, Tabouret, V, Syväjärvi, M, Wellmann, P & Chaussende, D 2023, ' Novel Photonic Applications of Silicon Carbide ', Materials, vol. 16, no. 3, 1014 . https://doi.org/10.3390/ma16031014
International audience; Silicon carbide (SiC) is emerging rapidly in novel photonic applications thanks to its unique photonic properties facilitated by the advances of nanotechnologies such as nanofabrication and nanofilm transfer. This review paper
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::84c564515678fa0d158b21e28b0e387f
Autor:
Peter J. Wellmann, Matthias Arzig, Jonas Ihle, Manuel Kollmuss, Johannes Steiner, Marco Mauceri, Danilo Crippa, Francesco La Via, Michael Salamon, Norman Uhlmann, Melissa Roder, Andreas N. Danilewsky, Binh Duong Nguyen, Stefan Sandfeld
Publikováno v:
Materials science forum 1062, 104-112 (2022). doi:10.4028/p-05sz31
The review on bulk growth of SiC includes a basic overview on the widely used physical vapor transport method for processing of 4H-SiC boules as well as the discussion of three current research topics: (a) Sublimation bulk growth of large area, frees
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8a95c8ee4d9b34d1b21ff7a2acda8935
https://juser.fz-juelich.de/record/908589
https://juser.fz-juelich.de/record/908589
Autor:
Valdas Jokubavicius, Mikael Syväjärvi, Massimo Zimbone, Marco Mauceri, Rositsa Yakimova, Anna Marzegalli, Ioannis Deretzis, Leo Miglio, Giuseppe Fisicaro, Michael Schöler, Emilio Scalise, Manuel Kollmuss, Francesco La Via, Corrado Bongiorno, Ruggero Anzalone, Antonino La Magna, Peter J. Wellmann, Danilo Crippa, Filippo Giannazzo, Andrey Sarikov, Cristiano Calabretta, Viviana Scuderi, Marcin Zielinski, Philipp Schuh
Publikováno v:
Materials, Vol 14, Iss 5348, p 5348 (2021)
Materials
Materials
In this review paper, several new approaches about the 3C-SiC growth are been presented. In fact, despite the long research activity on 3C-SiC, no devices with good electrical characteristics have been obtained due to the high defect density and high