Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Manuel Kleinbichler"'
Autor:
Vasileios Fotopoulos, David Mora-Fonz, Manuel Kleinbichler, Rishi Bodlos, Ernst Kozeschnik, Lorenz Romaner, Alexander L. Shluger
Publikováno v:
Nanomaterials, Vol 13, Iss 9, p 1464 (2023)
Voids in face-centered cubic (fcc) metals are commonly assumed to form via the aggregation of vacancies; however, the mechanisms of vacancy clustering and diffusion are not fully understood. In this study, we use computational modeling to provide a d
Externí odkaz:
https://doaj.org/article/01d04daf0f1146a6a5ec0eb97a7e4321
Publikováno v:
Applied Sciences, Vol 11, Iss 15, p 7009 (2021)
In many applications, voids in metals are observed as early degradation features caused by fatigue. In this publication, electropolishing is presented in the context of a novel sample preparation method that is capable of accessing voids in the inter
Externí odkaz:
https://doaj.org/article/6b45f7e5c3f349149e59a1976ca0ccd5
Autor:
Sebastian Moser, Manuel Kleinbichler, Johannes Zechner, Michael Reisinger, Michael Nelhiebel, Megan J. Cordill
Publikováno v:
Microelectronics Reliability. 137:114782
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8800adac8f374cb8c65030341e282f00
https://doi.org/10.1016/j.microrel.2022.114782
https://doi.org/10.1016/j.microrel.2022.114782
Autor:
Megan J. Cordill, Reinhard Pippan, Manuel Kleinbichler, Gerald Zernatto, Johannes Zechner, Sebastian Moser, Michael Nelhiebel
Publikováno v:
JOM. 71:3399-3406
A novel experimental setup is presented to thermomechanically cycle metallizations in situ and, at the same time, study the progress of gradual changes in their microstructure using scanning electron microscopy. Very high heating rates are achieved b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bb2355e27505589cc466caf806b194de
https://doi.org/10.1007/s11837-019-03695-2
https://doi.org/10.1007/s11837-019-03695-2
Autor:
Corinna Kofler, Manuel Stabentheiner, Michael Reisinger, Sebastian Moser, Johannes Zechner, Manuel Kleinbichler, Michael Nelhiebel, Ernst Kozeschnik
Publikováno v:
Microelectronics Reliability. 127:114387
The early stages of thermo-mechanical fatigue in 20-μm-thick copper films are studied using accelerated stress tests on poly‑silicon heater test chips. During loading, the samples are heated up from a base temperature of 100 °C to a maximum tempe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::78666234ddd99c29561efe90916ddb33
https://doi.org/10.1016/j.microrel.2021.114387
https://doi.org/10.1016/j.microrel.2021.114387
Publikováno v:
Applied Sciences
Volume 11
Issue 15
Applied Sciences, Vol 11, Iss 7009, p 7009 (2021)
Volume 11
Issue 15
Applied Sciences, Vol 11, Iss 7009, p 7009 (2021)
In many applications, voids in metals are observed as early degradation features caused by fatigue. In this publication, electropolishing is presented in the context of a novel sample preparation method that is capable of accessing voids in the inter
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e11d9a83b6ce9dc82f319729e406dcb1
https://doi.org/10.3390/app11157009
https://doi.org/10.3390/app11157009