Additive Manufacturing of Electronic Patterns for Harsh Environments

Autor: Nicolas Delavault, Tanguy Lacondemine, Rémy Kalmar, Manuel Fendler, Sofiane Achache, Frederic Sanchette

Publikováno v: ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.

The last decade has seen emerged numeric transition in industry, bringing new building blocks: Internet of Things (IoT) and additive manufacturing. A whole big new challenge was born based on sensors integration with the capability to bring intellige

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::2ad9a9b884c5f019b9690dd2924dc62c
https://doi.org/10.1115/ipack2022-94052

1.7 Packaged Electronic Additive Manufacturing

Autor: Manuel Fendler

Publikováno v: Ametis

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::b78b555713459dbc4784a488b4a6d74a
https://doi.org/10.1051/978-2-7598-2588-2.c008

Electro-mechanical studies of micro-tube insertion into Al–Cu pads for 10 μm pitch interconnection technology and 3D applications

Autor: François Marion, V. Mandrillon, H. Ribot, B. Goubault de Brugiere, M. Volpert, Alain Hazotte, Manuel Fendler

Publikováno v: Microelectronic Engineering
Microelectronic Engineering, Elsevier, 2013, 107, pp.84-90. ⟨10.1016/j.mee.2012.10.021⟩
Microelectronic Engineering, 2013, 107, pp.84-90. ⟨10.1016/j.mee.2012.10.021⟩

21st International Workshop on Materials for Advanced Metallization (MAM), Minatec Campus, Grenoble, FRANCE, MAR 11-14, 2012; International audience; Various interconnection technologies such as reflow soldering, thermo-compression, Direct Bond Inter

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::dbe5fb200412127752c0a059f835813f
https://doi.org/10.1016/j.mee.2012.10.021

Infrared camera based on a curved retina

Autor: Jérôme Primot, Etienne Le Coarer, Cyrille Pornin, Frédéric Berger, Baptiste Cloix, Delphine Dumas, Guillaume Druart, N. Baier, Manuel Fendler

Publikováno v: Optics Letters
Optics Letters, Optical Society of America-OSA Publishing, 2015, 37 (4), pp.653-655. ⟨10.1364/OL.37.000653⟩
Optics Letters, Optical Society of America, 2015, 37 (4), p. 653-655. ⟨10.1364/OL.37.000653⟩
Optics Letters, 2015, 37 (4), pp.653-655. ⟨10.1364/OL.37.000653⟩

International audience; Design of miniature and light cameras requires an optical design breakthrough to achieve good optical performance. Solutions inspired by animals’ eyes are the most promising. The curvature of the retina offers several advant

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a055b6b598932e9be417f9afb8b77d79
https://hal.archives-ouvertes.fr/hal-01226486/file/Dumas2015.pdf

Three-Dimensional Thermomechanical Simulation of Fine-Pitch High-Count Ball Grid Array Flip-Chip Assemblies

Autor: Napo Bonfoh, Paul Lipinski, W. Kpobie, Manuel Fendler, C. Dreistadt

Publikováno v: Journal of Electronic Materials
Journal of Electronic Materials, Institute of Electrical and Electronics Engineers, 2014, 43 (3), pp.671-684. ⟨10.1007/s11664-013-2669-x⟩

International audience; Flip-chip technology is increasingly prevalent in electronics assembly [three-dimensional (3D) system-in-package] and is mainly used at fine pitch for manufacture of megapixel large focal-plane detector arrays. To estimate the

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::cfab80fe20a56089ccd3be61c5aa7d4f
https://hal.univ-lorraine.fr/hal-03345864