Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Manuel Bauscher"'
Autor:
Dahiana Mojena-Medina, Moritz Hubl, Manuel Bäuscher, José Luis Jorcano, Ha-Duong Ngo, Pablo Acedo
Publikováno v:
Sensors, Vol 20, Iss 19, p 5711 (2020)
From electronic devices to large-area electronics, from individual cells to skin substitutes, printing techniques are providing compelling applications in wide-ranging fields. Research has thus fueled the vision of a hybrid, printing platform to fabr
Externí odkaz:
https://doaj.org/article/d09b3d170ad14965b2506ce0244bf6c1
Autor:
Xiaodong Hu, Piotr Mackowiak, Manuel Bäuscher, Oswin Ehrmann, Klaus-Dieter Lang, Martin Schneider-Ramelow, Stefan Linke, Ha-Duong Ngo
Publikováno v:
Micromachines, Vol 9, Iss 6, p 266 (2018)
In this paper, we present our work developing a family of silicon-on-insulator (SOI)–based high-g micro-electro-mechanical systems (MEMS) piezoresistive sensors for measurement of accelerations up to 60,000 g. This paper presents the design, simula
Externí odkaz:
https://doaj.org/article/4cf51b800a1842cda18ce5819b3b3e15
Autor:
Yucheng Zhang, Francesco Solozzi, Norbert Cselyuszka, Kurt Sorchag, Nikolai Andrianov, Manuel Bauscher, Michael Schiffer, Mohssen Moridi, Elmar Aschauer, Klaus-Dieter Lang, Martin Schneider-Ramelow
Publikováno v:
2022 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aab5aae6761ee876506bc3bb6dca3817
https://doi.org/10.1109/dtip56576.2022.9911752
https://doi.org/10.1109/dtip56576.2022.9911752
Autor:
Piotr Mackowiak, Samer Al-Magazachi, Ha-Duong Ngo, Kolja Erbacher, Kai Zoschke, Michael Schiffer, Klaus-Dieter Lang, Manuel Bauscher
Publikováno v:
DeSE
This paper describes a fabrication technology for embedding sensors into flex circuit with a partial glass carrier and the electrical test of the circuit. Two sensors with a device thickness of 20 μm have been embedded into the flex circuit. The tot
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9b943eacaa8ea9141df8496963de5a56
https://doi.org/10.1109/dese.2019.00167
https://doi.org/10.1109/dese.2019.00167
Autor:
Klaus-Dieter Lang, Piotr Mackowiak, Martin Schneider-Ramelow, Manuel Bauscher, Xiaodong Hu, Oswin Ehrmann, Stefan Linke, Ha-Duong Ngo
Publikováno v:
Micromachines
Micromachines, Vol 9, Iss 6, p 266 (2018)
Micromachines; Volume 9; Issue 6; Pages: 266
Micromachines, Vol 9, Iss 6, p 266 (2018)
Micromachines; Volume 9; Issue 6; Pages: 266
In this paper, we present our work developing a family of silicon-on-insulator (SOI)–based high-g micro-electro-mechanical systems (MEMS) piezoresistive sensors for measurement of accelerations up to 60,000 g. This paper presents the design, simula
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::880e4d792fef33ad01979be5ae235035
http://europepmc.org/articles/PMC6187311
http://europepmc.org/articles/PMC6187311
Autor:
Manuel Bauscher, Martin Ihle, Piotr Mackowiak, Ha-Duong Ngo, Klaus-Dieter Lang, Ulli Hansen, Biswajit Mukhopadhyay, Xiaodong Hu, Steffen Ziesche, Yucheng Zhang, Oliver Gyenge, Hans Walter, Simon Maus, Oswin Ehrmann, Ole Hoelck
Publikováno v:
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
This work helps to clarify the effects on bondable Low Temperature Cofiered Cofired Ceramic(LTCC) material from Fraunhofer IKTS under different bonding conditions as changes in temperature, voltage and time. The Paper investigates silicon bonded to L
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c284233c91d067f7e04d480ac600a83d
https://doi.org/10.1109/eptc.2016.7861529
https://doi.org/10.1109/eptc.2016.7861529