Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Manjunath M. Nayak"'
Publikováno v:
ICTACT Journal on Microelectronics, Vol 5, Iss 1, Pp 744-749 (2019)
Trend in electronic packaging towards reduction in the dimension of conductive tracks in printed wiring boards continues, adhesion at the interface between the laminated copper and the electroplated copper becoming critical issues. In order to improv
Autor:
Tadeusz Uhl, Manjunath M. Nayak, Krzysztof Grabowski, Saurabh Kumar, Pavitra Jain, Prosenjit Sen, Shreyas Srivatsa
Publikováno v:
Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2020
Sensing of physical parameters forms an important part of smart structures. The discovery of many nanomaterials in the past decades with unique physical properties has led to the development of nanomaterial-based sensors for smart structures and Stru
Publikováno v:
Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2020
Publikováno v:
Optik. 158:1063-1072
A stainless steel pressure sensor using rigid center diaphragm and a fixed guided beam with FBG sensor is proposed in this paper. Two bare FBGs are bonded on to the tensile and compressive regions of the fixed guided beam. The deflection of the diaph