Developing functional Prototypes by package modification using plasma FIB technology.

Autor: Gonzales, Michael, Cruz, Roddy, Parley, Martin, Lau, Jonathan, DiBattista, Michael, Routh, Bryan, Landin, Trevan, Carleson, Peter, Huggins, Ebb, Mani, Kenny

Publikováno v: 2012 19th IEEE International Symposium on the Physical & Failure Analysis of Integrated Circuits; 1/ 1/2012, p1-5, 5p