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pro vyhledávání: '"Mandal, Tapojyoti"'
Autor:
Chacon, Gino, Mandal, Tapojyoti, Knechtel, Johann, Sinanoglu, Ozgur, Gratz, Paul, Soteriou, Vassos
Industry is moving towards large-scale systems where processor cores, memories, accelerators, etc.\ are bundled via 2.5D integration. These various components are fabricated separately as chiplets and then integrated using an interconnect carrier, a
Externí odkaz:
http://arxiv.org/abs/2105.02917
