Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Manabu Tomisaka"'
Autor:
Seung Jin Oh, Takuji Okamura, Masataka Hoshino, Kazuo Kondo, Manabu Tomisaka, Kenji Takahashi, Hitoshi Yonemura, Jian-Jun Sun
Publikováno v:
Journal of the Electrochemical Society. 152(11):173-177
Through-chip electrodes for three-dimensional packaging can offer short interconnection and reduced signal delay. Formation of suitable vias by electrodeposition into cavities presents a filling problem similar to that encountered in the damascene pr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a8e97e393a9a4d4f10949c5008ab8f2e
https://ousar.lib.okayama-u.ac.jp/34177
https://ousar.lib.okayama-u.ac.jp/34177
Autor:
Takuji Okamura, Yuichi Taguchi, Kenji Takahashi, Hitoshi Yonemura, Toshihiro Yonezawa, Masataka Hoshino, Kazuo Kondo, Seung Jin Oh, Manabu Tomisaka
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 6:596-601
Through chip electrodes with high aspect ratios used for three dimensional packaging can offer the shortest interconnection and reduce signal delay. Copper has good compatibility to conventional multi layer interconnection in LSI and BEOL (back end o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7ca84d46e8e5de28dfe551918ddc76c6
https://doi.org/10.5104/jiep.6.596
https://doi.org/10.5104/jiep.6.596
Autor:
Manabu Bonkohara, Yoshihiko Nemoto, Kenji Takahashi, Tadahiro Morifuji, Tomotoshi Sato, Manabu Tomisaka, Masahiro Sunohara, Yoshihiro Tomita
Publikováno v:
JOURNAL OF CHEMICAL ENGINEERING OF JAPAN. 36:119-125
The electroless tin-plating on copper has the preferable characteristics for the thermal compression bonding, although it is easy to decrease in thickness by heating at the bonding because of the diffusion with copper. Therefore, the bonding profile
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::df99e416d1f4b546b7ecdb28991e478d
https://doi.org/10.1252/jcej.36.119
https://doi.org/10.1252/jcej.36.119
Autor:
Kazuo Kondo, Kenji Takahashi, Masataka Hoshino, Toshihiro Yonezawa, Manabu Tomisaka, Yuichi Taguchi, Hitoshi Yonemura
Publikováno v:
Extended Abstracts of the 2003 International Conference on Solid State Devices and Materials.
Through chip electrodes with high aspect ratios offer the shortest interconnection and reduce signal delay. In this work, filling vias with higher aspect ratio copper, 10 μm in square and 70 μm in depth, used for through chip electrodes was investi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e531a1e3d138f5599f36138a1bd12a1b
https://doi.org/10.7567/ssdm.2003.g-4-3
https://doi.org/10.7567/ssdm.2003.g-4-3
Publikováno v:
Extended Abstracts of the 2001 International Conference on Solid State Devices and Materials.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1d8071f259459a8f53a8fa78e1b13d9d
https://doi.org/10.7567/ssdm.2001.b-1-3
https://doi.org/10.7567/ssdm.2001.b-1-3
Publikováno v:
Japanese Journal of Applied Physics. 36:2822
An in situ optical observation method for investigations of fluoride surface modification induced by electron irradiation was developed for the purpose of improving the heteroepitaxy of semiconductors on fluorides. Spectra of reflected light after th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a86cacf6d8a4a01ccd2becef3d529c32
https://doi.org/10.1143/jjap.36.2822
https://doi.org/10.1143/jjap.36.2822
Publikováno v:
Japanese Journal of Applied Physics; May 1997, Vol. 36 Issue: 5 p2822-2822, 1p