Zobrazeno 1 - 10
of 17
pro vyhledávání: '"Manabu Bonkohara"'
Publikováno v:
Electronics and Communications in Japan (Part II: Electronics). 88:37-49
The national project of ultrahigh-density electronics SI (system integration) technology was started in 1999 and finalized in March 2004. Many research achievements occurred in various areas, such as three-dimensional integration, optoelectronic comp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e6ce1dfd0913dda9fe27af9178b47c0a
https://doi.org/10.1002/ecjb.20149
https://doi.org/10.1002/ecjb.20149
Autor:
Yoshihiro Tomita, Yoshihiko Nemoto, Naotaka Tanaka, Manabu Bonkohara, Masamoto Tago, Kazumasa Tanida, Mitsuo Umemoto, Kenji Takahashi
Publikováno v:
Microelectronics Reliability. 43:1267-1279
The study of 20-μm-pitch interconnection technology of three-dimensional (3D) packaging focused on reliability, ultrasonic flip–chip bonding and Cu bump bonding is described. The interconnection life under a temperature cycling test (TCT) was at a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::71578422e45350b91c7c6cf28caf9bd1
https://doi.org/10.1016/s0026-2714(03)00167-7
https://doi.org/10.1016/s0026-2714(03)00167-7
Autor:
Manabu Bonkohara, Yoshihiko Nemoto, Kenji Takahashi, Tadahiro Morifuji, Tomotoshi Sato, Manabu Tomisaka, Masahiro Sunohara, Yoshihiro Tomita
Publikováno v:
JOURNAL OF CHEMICAL ENGINEERING OF JAPAN. 36:119-125
The electroless tin-plating on copper has the preferable characteristics for the thermal compression bonding, although it is easy to decrease in thickness by heating at the bonding because of the diffusion with copper. Therefore, the bonding profile
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::df99e416d1f4b546b7ecdb28991e478d
https://doi.org/10.1252/jcej.36.119
https://doi.org/10.1252/jcej.36.119
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 6:48-55
The high-precision flip-chip bonding technologies in 20μm pitch are applied to connect the copper plugs through the Si devices with the micro bumps formed on the each copper plug for 3D LSI. Generally, it is said that the ultrasonic flip-chip bondin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8b708c887625756d5b23cee6621dfd86
https://doi.org/10.5104/jiep.6.48
https://doi.org/10.5104/jiep.6.48
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 5:473-477
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::80f6f8fd72b1703757923524eb93cff5
https://doi.org/10.5104/jiep.5.473
https://doi.org/10.5104/jiep.5.473
Autor:
Manabu Bonkohara
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 4:185-191
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d34c1a57aab57cb81d1f92835bde400f
https://doi.org/10.5104/jiep.4.185
https://doi.org/10.5104/jiep.4.185
Publikováno v:
MRS Proceedings. 970
Recently the development of three dimensional LSI (3D-LSI) has been accelerated and its stage has changed from the research level or limited production level to the investigation level with a view to mass production. This paper describes the current
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b3dacda696d479671e04c01556d941c9
https://doi.org/10.1557/proc-0970-y03-03
https://doi.org/10.1557/proc-0970-y03-03
Autor:
Manabu Bonkohara
Publikováno v:
Journal of SHM. 12:53-55
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0ecfad5baa7c4acb06c11a4ff35cda99
https://doi.org/10.5104/jiep1993.12.4_53
https://doi.org/10.5104/jiep1993.12.4_53
Publikováno v:
SPIE Proceedings.
We have developed opto-electronic conversion module termed " active interposer" and polymeric waveguide film lamination technologies for optical interconnects between LSI chips. The fabricated active interposers are composed of VCSELs, MSM-PDs , subm
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e771d18bddf200a57e96d854cacb8bb6
https://doi.org/10.1117/12.475557
https://doi.org/10.1117/12.475557
Autor:
Manabu Bonkohara, Toshio Sudo
Publikováno v:
Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects.
This paper reports simulation results on simultaneous switching noise and radiated emission due to the existence of on-chip decoupling capacitor. Signal overshoots/undershoots was observed for the case of on-chip decoupling capacitor, while signal de
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ce1a0000a607791b585ce52b580b7731
https://doi.org/10.1109/spi.2002.258278
https://doi.org/10.1109/spi.2002.258278