Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Man-Young Shin"'
Autor:
Junekyun Park, Hyun-Goo Jeon, Sam-Young Kim, Man-Young Shin, Kyung-Il Ouh, Sang-Cheol Shin, Back-Sung Kim, Hyun-Joon Cha, Jongwoo Park, Yong-Bum Jo
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 30:731-744
In this paper, the effects of Al pad contamination, epoxy molding compound [biphenyl (BP) and ortho-cresol novolac (OCN)] and wire (Au and alloy) on the propensity for the interfacial degradation of wire bond in a quad flap package under high tempera
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0c8ff73e995162b26ee4139f58469a18
https://doi.org/10.1109/tcapt.2007.906318
https://doi.org/10.1109/tcapt.2007.906318
Autor:
Gunrae Kim, Kyung-Il Ouh, Man-Young Shin, Yong-Bum Jo, Sang-chul Shin, Hyun-Jun Cha, Hyun-Goo Jeon, Junekyun Park, Back-Sung Kim, Jongwoo Park
Publikováno v:
2004 IEEE International Reliability Physics Symposium. Proceedings.
We have studied the interfacial degradation mechanism of Au-Al bonding in epoxy encapsulated quad flat package (QFP) induced by the high temperature storage (HTS) test conditions. In a way of root cause analysis to elucidate the degradation mechanism
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6f3ed8bb62aa37ef2824c7c8a8053c99
https://doi.org/10.1109/relphy.2004.1315393
https://doi.org/10.1109/relphy.2004.1315393
Autor:
Jongwoo Park, Hyun-Joon Cha, Back-Sung Kim, Yong-Bum Jo, June-Kyun Park, Sam-Young Kim, Sang-Cheol Shin, Man-Young Shin, Kyung-Il Ouh, Hyungoo Jeon
Publikováno v:
IEEE Transactions on Components & Packaging Technologies; Dec2007, Vol. 30 Issue 4, p731-744, 14p, 5 Black and White Photographs, 1 Diagram, 4 Charts, 9 Graphs
Autor:
Jongwoo Park, Back-Sung Kim, Hyun-Jun Cha, Yong-Bum Jo, Sang-Chul Shin, Gun-Rae Kim, June-Kyun Park, Man-Young Shin, Kyung-Il Ouh, Hyun-Goo Jeon
Publikováno v:
Proceedings of the 2004 IEEE International Reliability Physics Symposium; 2004, p569-570, 2p