Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Man-Chi Lan"'
Publikováno v:
Journal of Materials Research and Technology, Vol 27, Iss , Pp 7957-7963 (2023)
A large lattice mismatch between Ag and Cu commonly results in incoherently polycrystalline deposited features. It is very challenging to epitaxially deposit an Ag film on Cu. In this study, an epitaxial Ag film was electroless-deposited on nanotwinn
Externí odkaz:
https://doaj.org/article/09af45e55da540f4aa594bb19ad9e96e
Autor:
Jia-Juen Ong, Dinh-Phuc Tran, Man-Chi Lan, Kai-Cheng Shie, Po-Ning Hsu, Nien‑Ti Tsou, Chih Chen
Publikováno v:
Scientific Reports, Vol 12, Iss 1, Pp 1-10 (2022)
Abstract Cu–Cu joints have been adopted for ultra-high density of packaging for high-end devices. However, cracks may form and propagate along the bonding interfaces during fatigue tests. In this study, Cu–Cu joints were fabricated at 300 °C by
Externí odkaz:
https://doaj.org/article/3c73866eb56d472d9e067f29394f4cb9