Výsledky vyhledávání - "Man Prakash Gupta"

Multi-level Embedded 3d Manifold Microchannel Heat Sink of Aln Direct Bonded Copper for the High-power Electronic Module

Autor: Yujui Lin, Tiwei Wei, Wyatt Jason Moy, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, Alan Mantooth, Kenneth Goodson

Publikováno v: Journal of Electronic Packaging. :1-45

Better thermal management is a key enabler of higher power density in traction inverter power modules. For the first time, we successfully fabricated and tested a microchannel with a 3D manifold cooler (MMC) using AlN-based Directed Bonded Copper (DB

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::423a79fce44fd18211fe450c5bd62c7a
https://doi.org/10.1115/1.4062384

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Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers—Part 2: Parametric Study of EMMCs for High Heat Flux (∼1 kW/cm2) Power Electronics Cooling

Autor: Edward Chan-Jiun Jih, Sougata Hazra, Heungdong Kwon, Mehdi Asheghi, Ki Wook Jung, Michael W. Degner, Alisha Piazza, Man Prakash Gupta, Kenneth E. Goodson

Publikováno v: Journal of Electronic Packaging. 142

Thermal management of power electronics modules is one of the limiting factors in the peak power capability of the traction inverter system and overall efficiency of the e-drive. Liquid cooling using embedded microchannels with a three-dimensional (3

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::2014257c503e55d53f4d041dd8fb8770
https://doi.org/10.1115/1.4047883

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Considerations and Challenges for Large Area Embedded Micro-channels with 3D Manifold in High Heat Flux Power Electronics Applications

Autor: Sougata Hazra, Kenneth E. Goodson, Edward Chan-Jiun Jih, Mehdi Asheghi, Man Prakash Gupta, Alisha Piazza, Michael W. Degner, Ki Wook Jung

Publikováno v: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Embedded microchannel with 3D manifold heat sinks (EMMCs) offer two primary advantages over conventional microchannel heat sinks: increased thermal performance and decreased pressure loss. The unique 3D fluid routing mechanism of the manifold reduces

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::e6f2632e069153d544f4e8df8f3ac218
https://doi.org/10.1109/itherm45881.2020.9190179

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Microfabrication Challenges for Silicon-based Large Area (>500 mm2) 3D-manifolded Embedded Microcooler Devices for High Heat Flux Removal

Autor: Mike Degner, Man Prakash Gupta, Alisha Piazza, Edward Chan-Jiun Jih, Ki Wook Jung, Sougata Hazra, Kenneth E. Goodson, Mehdi Asheghi

Publikováno v: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

3D Manifolded embedded Micro-Coolers (3DMMC) devices are becoming increasingly attractive and thereby, sought after active cooling solutions for high power density electronic components and devices. 3D-MMCs have shown the potential to effectively coo

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::89592df266e4b4ea4c7dfaa8c9a53659
https://doi.org/10.1109/itherm45881.2020.9190541

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Computational Study of Thermal Transport in Nanowire-Graphene Thin Films

Autor: Man Prakash Gupta, Nitish Kumar, Satish Kumar

Publikováno v: IEEE Transactions on Nanotechnology. 17:829-836

Metal nanowires-doped polycrystalline graphene is recently shown to be very promising as transparent conducting material for many applications including solar cells, touchscreens, and light-emitting diodes. However, the thermal reliability of these t

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::3a001522c0d385b370e15b78dab5a025
https://doi.org/10.1109/tnano.2018.2843386

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Self-Consistent Electrothermal Modeling of Passive and Microchannel Cooling in AlGaN/GaN HEMTs

Autor: Satish Kumar, Ajit K Vallabhaneni, Man Prakash Gupta

Publikováno v: IEEE Transactions on Components, Packaging and Manufacturing Technology. 7:1305-1312

AlGaN/GaN high electronic mobility transistors (HEMTs) are highly promising for power and RF electronics due to large bandgap and high breakdown voltage. However, the thermal bottlenecks associated with the elevated temperatures in the device at high

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::8f0730d9c2b957668145ad84dc58d155
https://doi.org/10.1109/tcpmt.2017.2693399

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Parametric Study of Silicon-Based Embedded Microchannels With 3D Manifold Coolers (EMMC) for High Heat Flux (~1 kW/cm2) Power Electronics Cooling

Autor: Alisha Piazza, Edward Chan-Jiun Jih, Ki Wook Jung, Kenneth E. Goodson, Mehdi Asheghi, Heungdong Kwon, Man Prakash Gupta, Sougata Hazra, Mike Degner

Publikováno v: ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.

Thermal management of power electronics continues to be one of the limiting factors in the peak power capability of the traction inverter system and overall efficiency of the e-drive. Successful design and implementation of Embedded Microchannels wit

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::836faf338b6413102d99f83e15c8545a
https://doi.org/10.1115/ipack2019-6472

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