Zobrazeno 1 - 10
of 51
pro vyhledávání: '"Mamoru Mita"'
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 5:1160-1168
This paper discusses the formation of a conductive film from noble metal nanoparticles as an alternative to conventional electroplating for electrical components, such as connectors, switches, and memory cards. The proposed method consists in dispens
Autor:
Mamoru Mita, Takahisa Togashi, John C. Young, Takehito Suzuki, Keisuke Takano, Hideaki Kitahara, Masanori Hangyo
Publikováno v:
Applied Physics A. 118:397-402
Need for high-performance and sophisticated optical devices in the terahertz wave band is growing rapidly with terahertz technological progress. This paper presents a lens in the terahertz wave band based on phase control using an oblique metal slit
Publikováno v:
Transactions of The Japan Institute of Electronics Packaging. 9:E16-008
Publikováno v:
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
Thick copper wiring on ferrite/epoxy resin substrate was carried out by laser sintering of the paste prepared with 1 μm-diameter copper micro-particles and organic solvents. A 532 nm-wavelength Nd:YVO4 green laser has a high adsorption both to the c
Publikováno v:
2016 International Conference on Electronics Packaging (ICEP).
The present study discusses the formation of a conductive film from noble metal nanoparticles onto stainless steel substrate for electrical components, such as connectors, where conventional electroplating is not applicable. The proposed “laser pla
Autor:
Yorishige Matsuba, Mamoru Mita, Hiroshi Saito, Tomotake Niizeki, Katsuhiro Maekawa, Nobuto Terada, Kazuhiko Yamasaki
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 2:868-877
This paper proposes a “dry” laser-sintering method and discusses characteristics of a laser-sintered silver thin film on a polyimide or a copper substrate. This novel technology consists of the following processes: first, ink-jet printing of meta
Autor:
Mamoru Mita, Hiroshi Saito, Nobuto Terada, Yorishige Matsuba, Tomotake Niizeki, Kazuhiko Yamasaki, Katsuhiro Maekawa
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 15:96-105
Publikováno v:
Microelectronic Engineering. 87:843-847
A novel direct polymer-transfer lithography (DPTL) technique is proposed for fabricating fine patterns having feature sizes ranging from ten to several tens of micrometers with extremely high throughput. By means of this technique, a homemade fluorin
Autor:
Tomotake Niizeki, Kazuhiko Yamasaki, Nobuto Terada, Katsuhiro Maekawa, Hiroshi Saito, Mamoru Mita, Yorishige Matsuba
Publikováno v:
Transactions of The Japan Institute of Electronics Packaging. 3:7-13
The present paper proposes high-speed laser plating for forming wire-bonding pads on a Cu leadframe using Ag nanoparticles. The novelty of the process lies in the implementation of drop-on-demand laser plating on the specially designed leadframe. Var
Autor:
Kazuhiko Yamasaki, Hiroshi Saito, Tomotake Niizeki, Nobuto Terada, Katsuhiro Maekawa, Yorishige Matsuba, Mamoru Mita
Publikováno v:
Materials Science Forum. :2085-2090
The silver NanoPaste® having silver nanoparticles with 5 nm in average diameter, coated either on a polyimide substrate or a copper one, is successfully sintered with CW lasers. A rapid metallization from the paste surface with the visible laser mak