Zobrazeno 1 - 10
of 38
pro vyhledávání: '"Mamoru, Sakamoto"'
Autor:
Motomichi, Fujita, Manabu, Sasada, Mayu, Eguchi, Takuya, Iyoda, Shin, Okuyama, Takuro, Osawa, Kenta, Tsuzuranuki, Mamoru, Sakamoto, Yu, Hagihara, Masaki, Matsumura, Satoshi, Osada, Hiroaki, Kodama, Yoshikazu, Higami, Fumio, Fukai
Publikováno v:
Am J Cancer Res
Tenascin-C is upregulated during inflammation and tumorigenesis, and its expression level is correlated with a poor prognosis in several malignancies. Nevertheless, the substantial role of tenascin-C in cancer progression is poorly understood. Previo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=pmid_dedup__::8a1b9c0b0bc43243af564f3b0c7a6647
https://europepmc.org/articles/PMC8493383/
https://europepmc.org/articles/PMC8493383/
Publikováno v:
Ornamental Horticulture, Vol 17, Iss 1 (2011)
O Brasil possui grande potencial exportador de flores e plantas ornamentais, e o emprego de técnicas simples de armazenamento poderia viabilizar o transporte por modais que não o aéreo, reduzindo custos, podendo prolongar a vida útil dos produtos
Externí odkaz:
https://doaj.org/article/94046bd91550405289361836cf83ebcc
Publikováno v:
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
The cone-shaped micro bump provides fine-pitch room-temperature flip-chip Bonding technology. It has been demonstrated to be able to connect $15 \mu \mathrm {m}$-pitch 640x512 array pixels of an image sensor composed of a compound semiconductor photo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b407193ce03d9c11475cf1457d3832bd
https://doi.org/10.1109/eptc.2018.8654401
https://doi.org/10.1109/eptc.2018.8654401
Publikováno v:
2017 IEEE CPMT Symposium Japan (ICSJ).
Bonding dynamics during ultrasonic bonding of Cu free air ball (FAB) is investigated by measuring dynamic strain with piezoresistive strain sensor. Change in dynamic strain with elevating substrate temperature up to 200°C was investigated. It was cl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::896e57bbd03f0a4675d36aae7f95706f
https://doi.org/10.1109/icsj.2017.8240137
https://doi.org/10.1109/icsj.2017.8240137
Publikováno v:
2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition.
Impact of bonding temperature on bonding dynamics in the ultrasonic bonding of Cu FAB (free air ball) is investigated by measuring dynamic strain with piezoresistive strain sensor. The strain sensor was composed of an array of pairs of n-and p-type s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7f1e816639869ee97214a305b30632ea
https://doi.org/10.23919/empc.2017.8346852
https://doi.org/10.23919/empc.2017.8346852
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
Dynamic changes in distribution of mechanical strain generated during wire bonding in Si under and near the bonding pad were measured by using a piezoresistive linear array sensor. The sensor was designed to be able to determine strains in the direct
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::acae7bd19e9958ebafa44729f64106ff
https://doi.org/10.1109/ectc.2017.316
https://doi.org/10.1109/ectc.2017.316
Publikováno v:
Journal of the Society of Materials Science, Japan. 63:79-86
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6c9bdd9eba668bf7ad308b37eadbb873
https://doi.org/10.2472/jsms.63.79
https://doi.org/10.2472/jsms.63.79
Publikováno v:
Journal of the Society of Materials Science, Japan. 59:751-756
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d4dfe8a29d29f2a5f4e6c862e67a7c65
https://doi.org/10.2472/jsms.59.751
https://doi.org/10.2472/jsms.59.751
Publikováno v:
Journal of the Society of Materials Science, Japan. 59:733-736
In this study, experimental studies were conducted in order to promote a practical use of sand pre-mixed with fly-ash. The measuring method of the fly-ash content of sand pre-mixed with fly-ash were examined, and the influence of fly-ash content fluc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2b628c4f3ecebc17dfddf48aeb0df3d0
https://doi.org/10.2472/jsms.59.733
https://doi.org/10.2472/jsms.59.733
Autor:
Nelson Mamoru Sakamoto
Publikováno v:
Biblioteca Digital de Teses e Dissertações da USP
Universidade de São Paulo (USP)
instacron:USP
Universidade de São Paulo (USP)
instacron:USP
O mercado mundial de floricultura gera um fluxo de quase US$ 7bilhões anuais, atualmente concentrado em países como Holanda, Alemanha, Itália, Colômbia, Costa Rica, Equador, Quênia, Tailândia, Malásia, Israel e EUA. O Brasil ainda contribui po
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::adb364df61b63a5ccb342016c6d77cb5
https://doi.org/10.11606/d.11.2005.tde-02082005-123521
https://doi.org/10.11606/d.11.2005.tde-02082005-123521