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Autor:
Moufid Radji, Anas A. Hamoui, Yves Blaquiere, Walder Andre, Ricardo Izquierdo, Mamadou D. Diop
Publikováno v:
19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems.
This paper presents the electrical characterization of annular TSV technology for full wafer applications. A possible utilization of this technology is the WaferBoard™, a reconfigurable circuit board for rapid system prototyping. Electrical resista
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::34787f539b775814d6ec7eea6f302986
https://doi.org/10.1109/epeps.2010.5642596
https://doi.org/10.1109/epeps.2010.5642596
