Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Majid Tavakolibasti"'
Publikováno v:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::02cc696d418e9880a47a96c9aa3babb7
https://doi.org/10.1109/eurosime56861.2023.10100829
https://doi.org/10.1109/eurosime56861.2023.10100829
Publikováno v:
2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2d9888f47ea2461aa69ebb41c808745a
https://doi.org/10.1109/therminic52472.2021.9626477
https://doi.org/10.1109/therminic52472.2021.9626477
Autor:
Marcel Melzer, Roman Forke, Sven Zimmermann, Katja Meinel, Majid Tavakolibasti, Harald Kuhn, Chris Stoeckel, Thomas Otto
Publikováno v:
2021 Smart Systems Integration (SSI).
This paper reports on design, technology and mechanical characterization in air of a piezoelectric aluminum nitride (AlN) based micromachined ultrasonic transducer (PMUT) with six radial symmetric arrays. The PMUT consists of 4018 single membranes wi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::92d1343748301ea98d99ec68a46e13d0
https://doi.org/10.1109/ssi52265.2021.9467017
https://doi.org/10.1109/ssi52265.2021.9467017
Publikováno v:
2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP).
With the fast and continuous evolution of MEMS devices, scientists and engineers facing different challenges each day. They overcome these challenges, with new materials, new fabrication methods, and different physical concepts. Using new materials a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0b001a7ec72b0c48fa7f5d3c75773c12
https://doi.org/10.1109/dtip.2019.8752638
https://doi.org/10.1109/dtip.2019.8752638