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Autor:
Dayanand, N., Quah, A. C. T., Chen, C. Q., Ang, G. B., Moon, S., Mai, H. P. Ng Z. H., Lam, J.
Publikováno v:
2015 IEEE 22nd International Symposium on the Physical & Failure Analysis of Integrated Circuits; 2015, p322-326, 5p