Zobrazeno 1 - 10
of 28
pro vyhledávání: '"Mahmoud Shousha"'
Publikováno v:
AIP Advances, Vol 11, Iss 2, Pp 025216-025216-5 (2021)
An on-chip thin-film microtransformer with an improved coupling factor is shown in this paper. In addition to the development of this component, the characterization of the microtransformer and its use in the data transmission application are present
Externí odkaz:
https://doaj.org/article/f66a40ed558944aab5467aa2e848957f
Publikováno v:
AIP Advances, Vol 10, Iss 1, Pp 015206-015206-5 (2020)
This paper presents the development, characterization and application of a microtransformer with a bar magnetic core fabricated on silicon substrate using thin-film technology. The magnetic core, coils, and insulation layers were deposited using only
Externí odkaz:
https://doaj.org/article/e818e336b4924a9aa08b18bfdccb956f
Autor:
Andreas Schorer, Mahmoud Shousha, Sebastian Pfennig, Martin Haug, Lorandt Fölkel, Michael Brooks, Jonas Groten, Oliver Werzer
Publikováno v:
2023 IEEE Applied Power Electronics Conference and Exposition (APEC).
Publikováno v:
IEEE Journal of Emerging and Selected Topics in Power Electronics. 8:3644-3657
This article presents a miniaturized and cost-effective power management system (PMS) for low-voltage electromagnetic energy harvesters (EMEHs) operating in both battery-powered and batteryless applications. The PMS consists of two converters and the
Publikováno v:
2021 International Conference on IC Design and Technology (ICICDT).
Autor:
Mahmoud Shousha, Mike Wens, Sebastian Beringer, Jef Thoné, Martin Haug, Marc Christopher Wurz, Dragan Dinulovic, Alexander Gerfer
Publikováno v:
IEEE Transactions on Industry Applications. 55:5068-5077
This paper presents the design, fabrication, and characterization on silicon integrated magnetics for high-frequency power applications. The presented device achieves superior characteristics in terms of energy density, electrical resistance, current
Publikováno v:
2021 IEEE Applied Power Electronics Conference and Exposition (APEC).
This paper presents different design considerations of two different packaging approaches for micromodules, namely vertically integrated ferrite substrate based [1] and conventional overmolded side-by-side integration [2]. Production steps, EMI, and
Publikováno v:
2021 IEEE Applied Power Electronics Conference and Exposition (APEC).
This paper shows fully packaged on-chip microtransformers and microinductors fabricated on silicon using thin film technology. The devices are packaged using wafer level chip scale packaging (WLCSP) technology. The microtransformer device presented i
Publikováno v:
2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe).
This paper presents a cost-effective electromagnetic energy harvester (EMEH) based on wire-wound technology. It also shows the energy management system used to convert the EMEH's AC voltage to a DC one. The EH system is self-powered and does not requ
Autor:
Lothar Lehmann, Mahmoud Shousha, Lulu Peng, S. Lawrence Selvaraj, Chor Shu Cheng, Zishan Ali, Khaled El Shafey, Marcel Wieland, Yong Chau Ng, Nur Aziz Yosokumoro, Martin Haug, Dragan Dinulovic
Publikováno v:
2020 IEEE Applied Power Electronics Conference and Exposition (APEC).
In this paper, we are reporting the design, fabrication and characterization of on-chip solenoid inductors with novel magnetic thin-film core for high frequency DC-DC power conversion application. Our CMOS - BEOL process compatible micro-inductor fab