Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Mahmood, Kafil"'
Autor:
Larsson, Andreas, Vardoy, Astrid-Sofie B., Oldervoll, Froydis, Storstrom, Olav, Mielnik, Michal, Dalton, Eric, Mahmood, Kafil, Min, Deokki, Taklo, Maaike M. V.
Publikováno v:
13th InterSociety Conference on Thermal & Thermomechanical Phenomena in Electronic Systems; 1/ 1/2012, p235-244, 10p
Autor:
Shao, Han
With the rapid development of medical technology, implantable devices have been invented and widely used in many applications such as physiological monitoring, localized drug delivery, and biosensors. The artificial cardiac pacemaker, as one of the m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od______1535::e35bcfd256258e1a40728f07966b66ef
https://hdl.handle.net/10468/6907
https://hdl.handle.net/10468/6907
Autor:
Tao, Jing
Semiconductor chip packaging has evolved from single chip packaging to 3D heterogeneous system integration using multichip stacking in a single module. One of the key challenges in 3D integration is the high density interconnects that need to be form
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od______1535::ae5171c87c32c714c2e729dd6852e99e
https://hdl.handle.net/10468/2739
https://hdl.handle.net/10468/2739