Zobrazeno 1 - 10
of 11
pro vyhledávání: '"Magi Margalit Nagar"'
Publikováno v:
Journal of The Electrochemical Society. 163:D3053-D3061
Publikováno v:
Electrochimica Acta. 127:315-326
The inhibition effect of different polyether suppressors on the nucleation and growth of copper during galvanostatic deposition was investigated as a function of deposition current density and suppression strength. An increase in the deposition curre
Publikováno v:
Electrochimica Acta. 92:474-483
The electrochemical nucleation and growth of copper on a ruthenium–tantalum (RuTa) alloy from acid copper sulfate solutions has been studied. The mechanism of copper nucleation and growth during galvanostatic deposition was investigated as a functi
Autor:
Magi Margalit Nagar, Alan C. West, Philippe M. Vereecken, Johan Deconinck, Aleksandar Radisic, Liu Yang
Publikováno v:
Electrochimica Acta. 78:524-531
The direct copper plating on resistive non-copper substrates is studied using a multi-scale modeling approach. A micro-scale nucleation model is coupled with the macro-scale current distribution model to predict the coalescence thickness and the thic
Publikováno v:
ECS Transactions. 41:99-110
The effect of the molecular mass (Mm) of polyethylene glycol (PEG) and its derivatives on the copper island density (Np) on ruthenium-tantalum (RuTa) alloy was investigated by utilizing scanning electron microscopy (SEM) and galvanostatic methods. Th
Publikováno v:
ECS Transactions. 28:9-16
The electrochemical nucleation and growth of copper on a ruthenium-tantalum (RuTa) alloy has been studied using galvanostatic methods. The experimental results show that the island density is highly dependent on the bath composition and deposition pa
Publikováno v:
Electrochimica Acta. 55:3560-3571
The integration of an advanced inhibitor, potassium sorbate (K[CH3(CH)4CO2]), in a copper CMP slurry based on hydrogen peroxide and glycine is reported. The first part of the study discusses the slurry chemistry by qualitatively describing the proces
Publikováno v:
Electrochimica Acta. 55:2810-2816
This study reports on the effects of potassium sorbate (K[CH 3 (CH) 4 CO 2 ]) on copper chemical mechanical planarization (CMP) performance and demonstrates how the performance can be controlled by the inhibitor concentration in the slurry. The study
Autor:
Magi Margalit Nagar, Silvia Armini, Philippe M. Vereecken, Wouter Ruythooren, Katrien Strubbe, Aleksandar Radisic, Zaid El-Mekki, Henny Volders
Publikováno v:
ECS Transactions. 25:175-184
We have studied electrochemical deposition of copper on ruthenium-tantalum (Ru-Ta) alloy, tantalum (Ta), and cobalt (Co) substrates using cyclic voltammetry and galvanostatic methods. We show that a single-step direct-plating from acidic Cu bath appr
Publikováno v:
ECS Meeting Abstracts. :2329-2329
The effect of the inorganic components, namely copper sulfate (CuSO4), sulfuric acid (H2SO4) and hydrochloric acid (HCl) on the nucleation and growth of copper on Ru-based substrate is reported in the absence and the presence of a suppressor molecule