Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Magdalena Sienkiewicz"'
Autor:
Pawel Abramowicz, Jerzy Konstantynowicz, Bogdan Cylwik, Magdalena Sienkiewicz, Monika Gudowska-Sawczuk, Lech Chrostek, Ewa Gruszewska
Publikováno v:
Rheumatology International
It is reported that alterations in protein glycosylation are present in adult rheumatic diseases; however, the data related to pediatric rheumatic conditions are very scarce. The aim of this study was to assess the effect of juvenile idiopathic arthr
Autor:
Philippe Perdu, Abdellatif Firiti, Olivier Crepel, Magdalena Sienkiewicz, Kevin Sanchez, Dean Lewis
Publikováno v:
Microelectronics Reliability. 48:1529-1532
The mixed-mode ICs (Integrated Circuits), by involving multiple functions (digital, analog, RF, power) inside one device, are becoming more compact and useful. At the same time, their developments and Failure Analysis (FA) are more and more complex:
Publikováno v:
International Symposium for Testing and Failure Analysis.
This paper presents a case study on reliability reject on a Freescale mixed-mode IC. It focuses on a novel use of one of most frequently used failure localization techniques: static emission microscopy (EMMI) to localize a failure due to an electrica
Publikováno v:
International Symposium for Testing and Failure Analysis.
This paper presents a case study on scan test reject in a mixed mode IC. It focuses on the smart use of combined mature FA techniques, such as Soft Defect Localization (SDL) and emission microscopy (EMMI), to localize a random scan test anomaly at th
Autor:
Kevin Sanchez, Magdalena Sienkiewicz, Olivier Crepel, Dean Lewis, Abdellatif Firiti, Luigi Cattaneo, Philippe Perdu
Publikováno v:
International Symposium for Testing and Failure Analysis.
The failure localization on analog & mixed mode ICs in functional mode (AC signals) has become more and more challenging in the last few years. Due to an increasing integration and complexity of these devices, the number of defects, especially those
Publikováno v:
International Symposium for Testing and Failure Analysis.
Soft defects localization by laser techniques on dynamically working ICs is widely used for Failure Analysis (FA). In this context, many AC signal-oriented analysis methods have been introduced to date (SDL, LADA…) or are under development (xVM…)
Publikováno v:
2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits.
Technology advances in mixed-mode and analog ICs, involving multiple functions inside the device, make Failure Analysis (FA) difficult. Variation Mapping techniques based on Thermal Laser Stimulation (TLS [1],[2],[3]) have already proven their effici
Autor:
Kevin Sanchez, Olivier Crepel, Magdalena Sienkiewicz, Dean Lewis, Abdellatif Firiti, Philippe Perdu
Publikováno v:
International Symposium for Testing and Failure Analysis.
Soft defect localization techniques based on laser stimulation have become key techniques for a wide range of FA/debug issues. In this paper, we demonstrate the ability of these techniques to solve critical design issue in mixed-mode device for autom