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Publikováno v:
International Journal of Microwave and Wireless Technologies. 5:463-476
In this paper, the design and the measurements of three-dimensional through silicon vias (TSVs) based-integrated solenoids embedded within high-resistive silicon is presented. Prior to silicon implementation, a rigorous theoretical analysis is propos
Publikováno v:
International Journal of Microwave & Wireless Technologies; Aug2013, Vol. 5 Issue 4, pb1-b4, 1p
Publikováno v:
International Journal of Microwave & Wireless Technologies; Aug2013, Vol. 5 Issue 4, p463-476, 14p