Zobrazeno 1 - 10
of 28
pro vyhledávání: '"Madhusudan Iyengar"'
Publikováno v:
WSPC Series in Advanced Integration and Packaging ISBN: 9789811277931
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7f49dfb2a6a70474f4ea4173615da001
https://doi.org/10.1142/13458
https://doi.org/10.1142/13458
Autor:
Ravi Mahajan, Madhusudan Iyengar, John Shalf, John Bowers, Weihua Tang, Gamal Refai-Ahmed, William Chen, Bill Bottoms, Antai Xu, Amr Helmy, Ali Heydari, Abhijit Dasgupta
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::92b852c51bfb828b061bdea7d1db8015
https://doi.org/10.1115/1.0003674v
https://doi.org/10.1115/1.0003674v
Autor:
Ravi Mahajan, Madhusudan Iyengar, John Shalf, John Bowers, Weihua Tang, Gamal Refai-Ahmed, William Chen, Bill Bottoms, Antai Xu, Amr Helmy, Ali Heydari, Abhijit Dasgupta
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::da5978a0e2d0aaffb0a417af72a311f5
https://doi.org/10.1115/1.0003671v
https://doi.org/10.1115/1.0003671v
Autor:
Ki Wook Jung, Mehdi Asheghi, Chirag R. Kharangate, Christopher G. Malone, Kenneth E. Goodson, Daewoong Jung, Joseph Schaadt, Sangwoo Jung, Madhusudan Iyengar, Hyoungsoon Lee, Daeyoung Kong
Publikováno v:
International Journal of Heat and Mass Transfer. 141:145-155
Aggressive thermal management strategies such as liquid cooling have become essential for high-performance three-dimensional (3D) integrated circuit (IC) chips. Micro-pin fin arrays integrated between stacks can provide superior thermal performance w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dd8d26f0d81185a31a7768977b5bcb12
https://doi.org/10.1016/j.ijheatmasstransfer.2019.05.073
https://doi.org/10.1016/j.ijheatmasstransfer.2019.05.073
This book is a comprehensive guide on emerging cooling technologies for processors in microelectronics. It covers various topics such as chip-embedded two-phase cooling, monolithic microfluidic cooling, numerical modeling, and advances in materials e
Autor:
Ki Wook Jung, Kenneth E. Goodson, Madhusudan Iyengar, Sougata Hazra, Christopher G. Malone, Mehdi Asheghi
Publikováno v:
Journal of Electronic Packaging. 142
Laser machining is an inexpensive and fast alternative to conventional microfabrication techniques and has the capability to produce complicated three-dimensional (3D), hierarchical structures. It is especially important while performing rapid protot
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cb263a1e8633a5d456b2d6c2ad5316e8
https://doi.org/10.1115/1.4047847
https://doi.org/10.1115/1.4047847
Autor:
Farid Soroush, Christopher G. Malone, Madhusudan Iyengar, Ki Wook Jung, Kenneth E. Goodson, Mehdi Asheghi
Publikováno v:
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Thermal management of microprocessors and power electronics face major challenges including but not limited to a need for reliable and mechanically robust micro-cooler and micro-heat spreader devices. While the thermofluidic performances of the embed
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f0b51060e50f389bc60efbdb7b2980f3
https://doi.org/10.1109/itherm45881.2020.9190368
https://doi.org/10.1109/itherm45881.2020.9190368
Autor:
Hyoungsoon Lee, Eunho Cho, Christopher G. Malone, Daeyoung Kong, Daewoong Jung, Mehdi Asheghi, Chirag R. Kharangate, Madhusudan Iyengar, Kenneth E. Goodson, Ki Wook Jung, Haeun Lee
Publikováno v:
International Journal of Heat and Mass Transfer. 175:121192
Three-dimensional stacked electronics have substantially improved the electrical performance of integrated circuits. However, given the geometrical complexity and high pressure drop they entail, thermal management difficulties and energy requirements
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::788d984503162300fcb82eb91a36a708
https://doi.org/10.1016/j.ijheatmasstransfer.2021.121192
https://doi.org/10.1016/j.ijheatmasstransfer.2021.121192
Autor:
Mehdi Asheghi, Ki Wook Jung, Hyoungsoon Lee, Sael Lee, Chirag R. Kharangate, Christopher G. Malone, Madhusudan Iyengar, Kenneth E. Goodson, Haeun Lee, Min-Soo Kang
Publikováno v:
Applied Thermal Engineering. 194:117012
This study is part of two studies conducted for developing artificial neural-network-based tools for predicting the thermal and hydraulic performance of micro-pin fin heat sinks used for high-heat-flux electronic devices. The thermal design of high-h
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a456442cee38d939ffa1499bfc1da195
https://doi.org/10.1016/j.applthermaleng.2021.117012
https://doi.org/10.1016/j.applthermaleng.2021.117012
Autor:
Damena Agonafer, Binjian Ma, Kidus Guye, Madhusudan Iyengar, Mun Mun Nahar, Quan H. Chau, Jorge Padilla
Publikováno v:
Applied Thermal Engineering. 194:117109
Evaporation of liquid is important in a diverse range of engineering applications, such as ink-jet printing, pesticide spraying, micro- and nanofabrication, thin-film coatings, biochemical assays, deposition of DNA/RNA microarrays, the manufacture of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cdc47dbdd25b1f23156ab790bb8e926a
https://doi.org/10.1016/j.applthermaleng.2021.117109
https://doi.org/10.1016/j.applthermaleng.2021.117109