Zobrazeno 1 - 1
of 1
pro vyhledávání: '"Madhuri R. Narkhede"'
Autor:
Chin Hock Toh, Thomas J. Fitzgerald, Madhuri R. Narkhede, Alfred A. La Mar, Arun Raman, Dennis Prem Kumar Chandran
Publikováno v:
ASME 2007 InterPACK Conference, Volume 2.
This paper summarizes the intermetallic compounds (IMC) formation at the interface between thermal interface material (TIM) and nickel/gold plated integrated heat spreader (IHS) at varying Au thickness, and its impact on thermal reliability. Indium s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3241af21fe3bd9f8307e7de43daf175b
https://doi.org/10.1115/ipack2007-33505
https://doi.org/10.1115/ipack2007-33505
