Zobrazeno 1 - 10
of 17
pro vyhledávání: '"Madhukar Bhaskara Rao"'
Publikováno v:
ECS Journal of Solid State Science and Technology. 3:N3118-N3124
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c34f7de21878b8ab7c9d0d35dfda1772
https://doi.org/10.1149/2.018401jss
https://doi.org/10.1149/2.018401jss
Autor:
Susanne Leppack, Eugene C. Baryschpolec, Matthias Schaller, Madhukar Bhaskara Rao, Christin Bartsch, Andreas Ott, Aiping Wu
Publikováno v:
Microelectronic Engineering. 87:1685-1688
Implementation of CoWP metal caps into Cu/low-k integration schemes requires a wet stripper that not only gives efficient cleaning but also has good compatibility to CoWP and low-k dielectrics. This paper describes a novel non-fluoride CoWP compatibl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2f12812d70d572804effff6654fe658b
https://doi.org/10.1016/j.mee.2009.11.048
https://doi.org/10.1016/j.mee.2009.11.048
Autor:
Oriol Osso, Lourdes F. Vega, Madhukar Bhaskara Rao, Gautam Banerjee, Todd M. McEvoy, Dnyanesh Chandrakant Tamboli
Publikováno v:
ECS Transactions. 33:181-187
Ruthenium is proposed as an alternative liner material in sub 30-nm line-width device technology. Ruthenium is a noble metal and does not oxidize readily. Hence, it is possible to directly plate copper on ruthenium. Because of very low solubility of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6765ea9bed9c09a08f1f332f1ec4e21a
https://doi.org/10.1149/1.3489059
https://doi.org/10.1149/1.3489059
Publikováno v:
ECS Transactions. 19:127-134
Even as CMP technology is maturing, there are several new challenges that are testing the limits of existing post CMP cleaning processes and demand new innovative cleaning solutions. For copper interconnects, the primary challenge comes from likely c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5278aa2aa53944a6321ad82cfa5f1c8a
https://doi.org/10.1149/1.3123781
https://doi.org/10.1149/1.3123781
Autor:
Laura M. Matz, G. Banerjee, Reinhold H. Dauskardt, T.M. Wieder, Madhukar Bhaskara Rao, Mary Kathryn Haas, A.D.W. Thiel, Dave M. Gage, Mark Leonard O'neill
Publikováno v:
Solid State Phenomena. :377-380
The development of robust integration processes for low-dielectric-constant materials is critical in order to meet the ITRS timeline. For 45 nm and beyond, the roadmap dictates use of an advanced dielectric material with a bulk dielectric constant be
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::44d89af53a50d4f52f75785898bf8fd2
https://doi.org/10.4028/www.scientific.net/ssp.145-146.377
https://doi.org/10.4028/www.scientific.net/ssp.145-146.377
Publikováno v:
Separation Science and Technology. 34:2081-2093
The selective surface flow membrane is a nanoporous carbon membrane which separates gas mixtures by a selective adsorption–surface diffusion–desorption mechanism. It selectively permeates the larger and the more polar components of a feed gas mix
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5acd0be8100b3ebe7bbd33728898dcba
https://doi.org/10.1081/ss-100100757
https://doi.org/10.1081/ss-100100757
Publikováno v:
Separation and Purification Technology. 17:11-20
Pressure swing adsorption (PSA) processes are commonly used to produce pure hydrogen from the steam–methane reformer (SMR) off-gas. The typical hydrogen recoveries for PSA processes producing 99.999+% hydrogen are in the range 70–85%. The nanopor
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8413866ce6361894cec8185a9d66c527
https://doi.org/10.1016/s1383-5866(99)00021-0
https://doi.org/10.1016/s1383-5866(99)00021-0
Publikováno v:
Separation Science and Technology. 32:1589-1602
The Selective Surface Flow (SSF) membrane, consisting of a nanoporous carbon layer supported on a macroporous alumina tube, can be used to enrich hydrogen from a feed gas containing hydrogen and hydrocarbon mixtures. The membrane produces a hydrogen-
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f3220e1094282d3b8b0b5bc38b9cd6c0
https://doi.org/10.1080/01496399708004068
https://doi.org/10.1080/01496399708004068
Autor:
Bridget Horvath, Shawn Cassel, Madhukar Bhaskara Rao, Brenda Ross, Stephan Sinkwitz, Wendy Gehoel, Peng Zhang, Patrick Wong, Manuel Jaramillo
Publikováno v:
SPIE Proceedings.
In this paper, the standard ASML process was optimized to reduce LineWidth Roughness (LWR) while minimizing the impact on other process performance criteria such as Depth Of Focus (DOF) and Exposure Latitude (EL). The impact of classical process opti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::67b98320c1bed1c0d0ecca46aed853d4
https://doi.org/10.1117/12.657875
https://doi.org/10.1117/12.657875
Publikováno v:
SPIE Proceedings.
The improvement in effective resolution of photo masks and templates is demonstrated by reducing pattern collapse through the use of surface conditioners. The masks were coated with a chemically amplified negative e-beam resist, FEN270, and exposed o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d1dc23ed9430772e7a5c9f9c9a611ba5
https://doi.org/10.1117/12.657620
https://doi.org/10.1117/12.657620