Zobrazeno 1 - 10
of 34
pro vyhledávání: '"Maciej Wojnowski"'
Autor:
Maciej Wojnowski, Walter Hartner, J. Lodermeyer, Christian Geissler, Markus Fink, Martin Richard Niessner, Francesca Arcioni, Gerhard Haubner
Publikováno v:
Journal of Surface Mount Technology. 34:32-39
Embedded wafer level ball grid array (eWLB) or FO-WLP (Fan-out wafer-level packaging) is investigated as a package for MMICs (Monolithic Microwave Integrated Circuit) for automotive radar applications in the 77GHz range. Special focus is put on the t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0921a4ab29dbe0fc90bbe34fc4bf2b9c
https://doi.org/10.37665/smt.v34i1.12
https://doi.org/10.37665/smt.v34i1.12
Autor:
Maciej Wojnowski, Klaus Pressel
Publikováno v:
Antenna-in-Package Technology and Applications
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ca6c391a2656b3f5bcb3a8f92c076177
https://doi.org/10.1002/9781119556671.ch8
https://doi.org/10.1002/9781119556671.ch8
Publikováno v:
2022 IEEE 22nd Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6e0663fcdc58001a6e62c4f29e6e36a4
https://doi.org/10.1109/sirf53094.2022.9720038
https://doi.org/10.1109/sirf53094.2022.9720038
Publikováno v:
2020 IEEE MTT-S International Wireless Symposium (IWS).
The fast growing market for system-in-package (SiP) solutions goes along with the continous evolution of important integration platforms such as the embedded wafer-level ball grid array (eWLB) package. In this article, we highlight three important de
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e70d60bb0377196106ff0604c5188ebe
https://doi.org/10.1109/iws49314.2020.9360140
https://doi.org/10.1109/iws49314.2020.9360140
Publikováno v:
IEEE Microwave Magazine. 19:48-56
Recent advances in silicon semiconductor technology with transit and maximum oscillation frequencies above 300 GHz have enabled the integration of complex transceiver front ends operating in the millimeter-wave (mmW) regime for a variety of applicati
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bdceac0cf21d544587a8f2fc80badbb2
https://doi.org/10.1109/mmm.2017.2759558
https://doi.org/10.1109/mmm.2017.2759558
Publikováno v:
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
The inductance of a coil can be increased by passing the magnetic flux through a high permeability magnetic core. Due to flux leakage in most of the inductor designs, not all of the magnetic flux flows in the core. In this paper, we propose a low pro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c8a33518f5ee75993fcb069c837b3a44
https://doi.org/10.1109/eptc.2018.8654356
https://doi.org/10.1109/eptc.2018.8654356
Publikováno v:
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
We present three concepts for the realization of eWLB package integrated monostatic radar transceiver front-ends in the 57 GHz to 64 GHz ISM band and discuss suitable building blocks such as transmission lines, baluns and couplers.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::15ce5a46b8bd5216f850998a31956f6e
https://doi.org/10.1109/eptc.2018.8654332
https://doi.org/10.1109/eptc.2018.8654332
Autor:
Ismail Nasr, Maciej Wojnowski, Ashutosh Baheti, Jagjit Singh Bal, Ivan Poupyrev, Reinhard W. Jungmaier, Emre Karagozler, Hakim Kader Bhai Raja, Saverio Trotta, Dennis Noppeney, Jaime Lien
Publikováno v:
IEEE Journal of Solid-State Circuits. 51:2066-2076
This work presents a highly integrated 57–64 GHz 4-channel receiver 2-channel transmitter chip targeting short range sensing and large bandwidth communications. The chip is housed in an embedded wafer level ball grid array package. The package incl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9a9d58a743c86ac42e7488a59818db68
https://doi.org/10.1109/jssc.2016.2585621
https://doi.org/10.1109/jssc.2016.2585621
Publikováno v:
2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
We prove design concepts for embedded wafer level ball grid array package integrated circularly polarized antennas in the 57 GHz to 64 GHz ISM band. Therefore, we propose performance requirements and evaluate the properties of four different antenna-
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::52e4ae7748a0569b2c4c2992bb395dfe
https://doi.org/10.1109/epeps.2018.8534303
https://doi.org/10.1109/epeps.2018.8534303
Publikováno v:
International Symposium on Microelectronics. 2013:000171-000176
More than Moore is a major trend to tackle the increasing difficulties of traditional Moore's law scaling. System in Package technologies, which allow heterogeneous integration, are appearing in ever more electronic applications. Furthermore we obser
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ed89ac098e8faf28c8781259a5d044d3
https://doi.org/10.4071/isom-2013-ta61
https://doi.org/10.4071/isom-2013-ta61