Development of novel electrospun absorbable polycaprolactone (PCL) scaffolds for hernia repair applications.

Autor: Ebersole GC, Buettmann EG, Macewan MR, Tang ME, Frisella MM, Matthews BD, Deeken CR, Ebersole, Gregory C, Buettmann, Evan G, MacEwan, Matthew R, Tang, Michael E, Frisella, Margaret M, Matthews, Brent D, Deeken, Corey R

Publikováno v: Surgical Endoscopy & Other Interventional Techniques; Oct2012, Vol. 26 Issue 10, p2717-2728, 12p

Bioresorbable shape-adaptive structures for ultrasonic monitoring of deep-tissue homeostasis.

Autor: Liu J; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA., Liu N; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA., Xu Y; The Institute of Materials Science and Engineering, Washington University in St. Louis, St. Louis, MO 63130, USA.; Department of Neurosurgery, Washington University School of Medicine, St. Louis, MO 63110, USA., Wu M; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA., Zhang H; Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA., Wang Y; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.; Department of Biomedical Engineering, Northwestern University, Evanston, IL 60208, USA., Yan Y; Department of Neurosurgery, Washington University School of Medicine, St. Louis, MO 63110, USA., Hill A; Department of Surgery, Washington University School of Medicine, St. Louis, MO 63110, USA., Song R; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.; Department of Chemical and Biological Engineering, Northwestern University, Evanston, IL 60208, USA., Xu Z; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA., Park M; Department of Polymer Science and Engineering, Dankook University, Yongin 16890, Republic of Korea., Wu Y; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA., Ciatti JL; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA., Gu J; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA., Luan H; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA., Zhang Y; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA., Yang T; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA., Ahn HY; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA., Li S; Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA., Ray WZ; Department of Neurosurgery, Washington University School of Medicine, St. Louis, MO 63110, USA., Franz CK; Regenerative Neurorehabilitation Laboratory, Shirley Ryan AbilityLab, Chicago, IL 60611, USA.; Department of Physical Medicine and Rehabilitation, Feinberg School of Medicine, Northwestern University, Chicago, IL 60611, USA.; The Ken and Ruth Davee Department of Neurology, Feinberg School of Medicine, Northwestern University, Chicago, IL 60611, USA., MacEwan MR; Department of Neurosurgery, Washington University School of Medicine, St. Louis, MO 63110, USA., Huang Y; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.; Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA.; Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA., Hammill CW; Department of Surgery, Washington University School of Medicine, St. Louis, MO 63110, USA., Wang H; Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, China.; Institute of Flexible Electronics Technology of THU Zhejiang, Jiaxing 314000, China., Rogers JA; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.; Department of Biomedical Engineering, Northwestern University, Evanston, IL 60208, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA.; Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.; Department of Neurological Surgery, Feinberg School of Medicine, Northwestern University, Chicago, IL 60611, USA.

Publikováno v: Science (New York, N.Y.) [Science] 2024 Mar 08; Vol. 383 (6687), pp. 1096-1103. Date of Electronic Publication: 2024 Mar 07.

Intramuscular Microvascular Flow Sensing for Flap Monitoring in a Porcine Model of Arterial and Venous Occlusion.

Autor: Lu D; Center of Bio-Integrated Electronics, Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois., Moritz W; Division of Plastic and Reconstructive Surgery, Department of Surgery, School of Medicine, Washington University, St. Louis, Missouri., Arafa HM; Center of Bio-Integrated Electronics, Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois., Yang Q; Center of Bio-Integrated Electronics, Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois., Jacobson L; Division of Plastic and Reconstructive Surgery, Department of Surgery, School of Medicine, Washington University, St. Louis, Missouri., Ostojich D; Center of Bio-Integrated Electronics, Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois., Bai W; Department of Applied Physical Sciences, The University of North Carolina at Chapel Hill, Chapel Hill, North Carolina., Guo H; Center of Bio-Integrated Electronics, Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois., Wu C; Center of Bio-Integrated Electronics, Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois., Li S; Center of Bio-Integrated Electronics, Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois., Li S; Department of Mechanical Engineering, Northwestern University, Evanston, Illinois., Huang Y; Department of Mechanical Engineering, Northwestern University, Evanston, Illinois., Xu Y; Department of Neurosurgery, School of Medicine, Washington University, St. Louis, Missouri., Yan Y; Department of Neurosurgery, School of Medicine, Washington University, St. Louis, Missouri., Westman AM; Division of Plastic and Reconstructive Surgery, Department of Surgery, School of Medicine, Washington University, St. Louis, Missouri., MacEwan MR; Department of Neurosurgery, School of Medicine, Washington University, St. Louis, Missouri., Rogers JA; Center of Bio-Integrated Electronics, Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois., Pet MA; Division of Plastic and Reconstructive Surgery, Department of Surgery, School of Medicine, Washington University, St. Louis, Missouri.

Publikováno v: Journal of reconstructive microsurgery [J Reconstr Microsurg] 2023 Mar; Vol. 39 (3), pp. 231-237. Date of Electronic Publication: 2022 Aug 11.

Electroactive Spinal Instrumentation for Targeted Osteogenesis and Spine Fusion: A Computational Study.

Autor: Javeed S; Department of Neurosurgery, Washington University School of Medicine, St. Louis, MO, USA., Zhang JK; Department of Neurosurgery, Washington University School of Medicine, St. Louis, MO, USA., Greenberg JK; Department of Neurosurgery, Washington University School of Medicine, St. Louis, MO, USA., Dibble CF; Department of Neurosurgery, Washington University School of Medicine, St. Louis, MO, USA., Zellmer E; Department of Biomedical Engineering, Washington University School of Medicine, St. Louis, MO, USA., Moran D; Department of Biomedical Engineering, Washington University School of Medicine, St. Louis, MO, USA., Leuthardt EC; Department of Neurosurgery, Washington University School of Medicine, St. Louis, MO, USA.; Department of Biomedical Engineering, Washington University School of Medicine, St. Louis, MO, USA., Ray WZ; Department of Neurosurgery, Washington University School of Medicine, St. Louis, MO, USA.; Department of Biomedical Engineering, Washington University School of Medicine, St. Louis, MO, USA., MacEwan MR; Department of Neurosurgery, Washington University School of Medicine, St. Louis, MO, USA macewanm@wustl.edu.; Department of Biomedical Engineering, Washington University School of Medicine, St. Louis, MO, USA.

Publikováno v: International journal of spine surgery [Int J Spine Surg] 2023 Feb; Vol. 17 (1), pp. 95-102. Date of Electronic Publication: 2023 Jan 25.

High-speed, scanned laser structuring of multi-layered eco/bioresorbable materials for advanced electronic systems.

Autor: Yang Q; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.; Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA., Hu Z; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA., Seo MH; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA.; School of Biomedical Convergence Engineering, College of Information & Biomedical Engineering, Pusan National University, Pusan, 46241, Republic of Korea., Xu Y; The Institute of Materials Science and Engineering, Washington University in St. Louis, St. Louis, MO, 63130, USA., Yan Y; Department of Neurosurgery, Washington University School of Medicine in St. Louis, St. Louis, MO, 63130, USA., Hsu YH; Department of Chemistry, Duke University, Durham, NC, 27708, USA., Berkovich J; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA., Lee K; Department of Biological Sciences, Northwestern University, Evanston, IL, 60208, USA., Liu TL; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.; Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA., McDonald S; Department of Chemistry, Duke University, Durham, NC, 27708, USA., Nie H; Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA., Oh H; Department of Neurobiology, Northwestern University, Evanston, IL, 60208, USA., Wu M; Department of Neurobiology, Northwestern University, Evanston, IL, 60208, USA., Kim JT; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA., Miller SA; Laser and Electronics Design Core Facility, Northwestern University, Evanston, IL, 60208, USA., Jia Y; Micro/Nano Fabrication Facility, Northwestern University, Evanston, IL, 60208, USA., Butun S; Micro/Nano Fabrication Facility, Northwestern University, Evanston, IL, 60208, USA., Bai W; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.; Department of Applied Physical Sciences, University of North Carolina at Chapel Hill, Chapel Hill, NC, 27599, USA., Guo H; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA., Choi J; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA., Banks A; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA., Ray WZ; Department of Neurosurgery, Washington University School of Medicine in St. Louis, St. Louis, MO, 63130, USA., Kozorovitskiy Y; Department of Neurobiology, Northwestern University, Evanston, IL, 60208, USA.; Developmental Therapeutics Core, Northwestern University, Evanston, IL, 60208, USA., Becker ML; Department of Chemistry, Duke University, Durham, NC, 27708, USA.; Department of Biomedical Engineering and Orthopaedic Surgery, Duke University, Durham, NC, 27708, USA., Pet MA; Division of Plastic and Reconstructive Surgery, Washington University School of Medicine in St. Louis, St. Louis, MO, 63130, USA., MacEwan MR; Department of Neurosurgery, Washington University School of Medicine in St. Louis, St. Louis, MO, 63130, USA., Chang JK; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.; Wearifi Inc., Evanston, IL, 60201, USA., Wang H; Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA. helingwang1@gmail.com.; Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China. helingwang1@gmail.com.; Zhejiang Tsinghua Institute of Flexible Electronics Technology, Jiaxing, 314000, China. helingwang1@gmail.com., Huang Y; Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA. y-huang@northwestern.edu.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA. y-huang@northwestern.edu.; Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, 60208, USA. y-huang@northwestern.edu., Rogers JA; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA. jrogers@northwestern.edu.; Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA. jrogers@northwestern.edu.; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA. jrogers@northwestern.edu.; Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA. jrogers@northwestern.edu.; Department of Neurological Surgery, Feinberg School of Medicine, Northwestern University, Chicago, IL, 60611, USA. jrogers@northwestern.edu.

Publikováno v: Nature communications [Nat Commun] 2022 Oct 31; Vol. 13 (1), pp. 6518. Date of Electronic Publication: 2022 Oct 31.