Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Maan Zaid Kokash"'
Autor:
Sanoop Thekkut, Maan Zaid Kokash, Rajesh Sharma Sivasubramony, Yuki Kawana, Kabir Mirpuri, Ninad Shahane, Patrick Thompson, Christopher M. Greene, Peter Borgesen
Publikováno v:
Journal of Electronic Packaging. 144
The inelastic deformation properties of sintered metal nanoparticle joints are complicated by the inherent nanocrystalline and nanoporous structures, as well as by dislocation networks formed in sintering or under cyclic loading. Creep rates of sinte
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bb1aa13f156d6b1c8890670e3c958ea6
https://doi.org/10.1115/1.4051728
https://doi.org/10.1115/1.4051728
Autor:
Kabir Mirpuri, Rajesh Sharma Sivasubramony, Christopher Greene, Maan Zaid Kokash, Ninad Shahane, Patrick Thompson, Sanoop Thekkut, Kawana Yuki, Peter Borgesen
Publikováno v:
Journal of Electronic Packaging. 144
Fused or sintered Cu nanoparticle structures are potential alternatives to solder for ultrafine pitch flip chip assembly and to sintered Ag for heat sink attach in high-temperature micro-electronics. Meaningful testing and interpretation of test resu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e22bfdaba6021bc8392722dd481662d9
https://doi.org/10.1115/1.4050871
https://doi.org/10.1115/1.4050871
Autor:
Peter Borgesen, Mohammed Alhendi, Maan Zaid Kokash, Rajesh Sharma Sivasubramony, E. Enakerakpo, Nardeeka Adams, Mark D. Poliks, Manu Yadav, Arun Raj, Sanoop Thekkut
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
The life of a flexible hybrid electronics (FHE) product under realistic use conditions may often be limited by fatigue of the interconnects between components. This is especially true for printed traces on flex. Even if the product is only intended f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::518ca7555cbb00034780ccd6e4542fbd
https://doi.org/10.1109/ectc32862.2020.00196
https://doi.org/10.1109/ectc32862.2020.00196
Autor:
Mark D. Poliks, Joe Iannotti, Guvinder S. Khinda, Maan Zaid Kokash, Darshana L. Weerawarne, Peter Borgesen, Mohammed Alhendi, Jack P. Lombardi, Nancy C. Stoffel
Publikováno v:
International Symposium on Microelectronics. 2018:000543-000548
In the presented work, electrical traces were directly printed on 2 mil thick polyimide flexible substrate by a dispenser system using two different silver pastes, SW 1400 paste from Asahi Co. and 125-13 HV paste from Creative Materials Co. The dispe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::963df8af9788f8fb79776c39fdafa8b2
https://doi.org/10.4071/2380-4505-2018.1.000543
https://doi.org/10.4071/2380-4505-2018.1.000543
Autor:
Gurvinder Singh Khinda, Peter Borgesen, Mohammed Alhendi, Darshana L. Weerawarne, Nancy C. Stoffel, Jack P. Lombardi, Mark D. Poliks, Maan Zaid Kokash, Manu Yadav
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Inkjet printing of conducting traces offers well established advantages and disadvantages as an alternative to electroplating of interconnects in flexible electronics. Assessment and optimization of their reliability is, however, often more complicat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ed961656d35826bb234ac46176b59204
https://doi.org/10.1109/ectc.2019.00299
https://doi.org/10.1109/ectc.2019.00299
Autor:
Darshana L. Weerawarne, Jack P. Lombardi, Gurvinder Singh Khinda, Sanoop Thekkut, Nancy C. Stoffel, Arun Raj, Liang Yin, Ashwin Varkey Zachariah, Rajesh Sharma Sivasubramony, David Shaddock, Nardeeka Adams, Mark D. Poliks, Maan Zaid Kokash, Manu Yadav, Peter Borgesen, Mohammed Alhendi
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
The development of reliable Flexible Hybrid Electronics (FHE) that are light, wearable and conforming to the human body while still preserving full operational integrity requires among other an understanding of the fatigue behavior of interconnects s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6e5e4d33e292607b7984561bd50933cc
https://doi.org/10.1109/ectc.2018.00138
https://doi.org/10.1109/ectc.2018.00138
Autor:
Maan Zaid Kokash, D. Blass, J. L. Then Cuevas, A. F. Zamudio, Y.-L. Tseng, Peter Borgesen, R. M. Stoltenberg, JiaJia Chang, Alfred A. Zinn, Rajesh Sharma Sivasubramony
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
Alternatives to solder suitable for operating temperatures above 175°C or so include sintered Ag as well as fused nano-particles of Ag or Cu, and micron-scale Cu particles fused with and bonded together by Ag nano-particles. The nature of these is v
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1de10d45caf7af2e92ba53f8ad40e1c4
https://doi.org/10.1109/ectc.2017.88
https://doi.org/10.1109/ectc.2017.88