Zobrazeno 1 - 10
of 65
pro vyhledávání: '"Ma, Jusheng"'
Autor:
Bai, Peng a, b, Zhu, Guang a, c, Jing, Qingshen a, Wu, Ying a, Yang, Jin a, Chen, Jun a, Ma, Jusheng b, Zhang, Gong b, Wang, Zhong Lin a, c, ⁎
Publikováno v:
In Nano Energy March 2015 12:278-286
Publikováno v:
In Applied Surface Science 2003 211(1):250-258
Publikováno v:
In Materials Science & Engineering B 2002 94(1):48-53
Publikováno v:
In Materials Science & Engineering A 2002 337(1):274-280
Publikováno v:
In Metal Finishing 2001 99(12):11-13
Akademický článek
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Autor:
Geng Zhiting, Wang Tao, Guo Shumei, Ning Honglong, Li Hong, Ma Jusheng, Lou Huafen, Huang Fuxiang, Yu Xuetao, Lu Chao
Publikováno v:
Scripta Materialia. 48:97-102
Phases of a Cu–0.31%Cr–0.21%Zr alloy were analyzed by scanning electronic microscope and energy dispersive X-ray spectroscopy (EDXS) and transmission electronic microscope (TEM). The EDXS results showed that there are three types of phases in the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3e9c0f73c181dd53f660c7ea75d93434
https://doi.org/10.1016/s1359-6462(02)00353-6
https://doi.org/10.1016/s1359-6462(02)00353-6
Publikováno v:
2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.
By means of establishing experimental model, the mechanical behavior and changes in basic parameters of new Sn-Zn system lead-free solder joint in thermal fatigue process were studied, and using the result to evaluate the performance of this new type
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7fcf2cfca293bfee6ea88e10cfe606cb
https://doi.org/10.1109/icept.2011.6066944
https://doi.org/10.1109/icept.2011.6066944
Publikováno v:
Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003..
The effect of chemical species in the leadframe materials on the interface microstructure between copper alloy and SnPb solder was studied by an optical microscope and scanning electron microscope (SEM) equipped with energy dispersive X-ray spectrosc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::31f2cd6974d9932a9f295818093ee74a
https://doi.org/10.1109/eptc.2003.1298777
https://doi.org/10.1109/eptc.2003.1298777
Publikováno v:
2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225).
The influences of several factors on the etching rates of Cu in FeCl/sub 3/ etchant are studied with a spray etching apparatus in this paper. The Cu etching surfaces are analyzed by XRD, and it is shown that there is a CuCl passivation film on the et
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::22149c88bb8efcaa6e01967f6612a2d4
https://doi.org/10.1109/iemtim.1998.704541
https://doi.org/10.1109/iemtim.1998.704541