Zobrazeno 1 - 10
of 164
pro vyhledávání: '"MUTHARASU, Devarajan"'
Publikováno v:
Journal of Materials Research and Technology, Vol 19, Iss , Pp 4504-4516 (2022)
Suitable coatings on electronic packaging substrates are generally preferred to surround the internal components, protect them from adverse conditions, and improve heat-dissipating performance. Such coatings are developed using different deposition t
Externí odkaz:
https://doaj.org/article/a07cc59c276b46c596541f35fbf3c94a
Autor:
Ramar, Alagar 1, Chen, Tse-Wei 2, 3, Chen, Shen-Ming 2, 3, Mutharasu, Devarajan 1, Rwei, Syang-Peng 3, 4
Publikováno v:
In International Journal of Electrochemical Science October 2018 13(10):9721-9730
Publikováno v:
AIMS Materials Science, Vol 5, Iss 3, Pp 402-413 (2018)
In a solid-state lighting, the thermal performance of light emitting diode (LED) is one of the crucial aspects in determining the quality of the LED. To improve the thermal performance of LED, thermal interface material (TIM) was employed and proven
Externí odkaz:
https://doaj.org/article/56bd7e62952e4fd49862026a53f973ef
Publikováno v:
Results in Physics, Vol 7, Iss , Pp 3882-3891 (2017)
To ensure the highest quality & long-term reliability of LED components it is necessary to examine LED dice that have sustained mechanical damage during the manufacturing process. This paper has demonstrated that detection of die crack in mass manufa
Externí odkaz:
https://doaj.org/article/8de08f1e2b1f4820a70e277547251053
Publikováno v:
Microelectronics International.
Purpose Light emitting diode (LED) has been the best resource for commercial and industrial lighting applications. However, thermal management in high power LEDs is a major challenge in which the thermal resistance (Rth) and rise in junction temperat
Publikováno v:
Microelectronics International.
Purpose Polymer-based thermal interface materials (TIMs) are having pump out problem and could be resolved for reliable application. Solid-based interface materials have been suggested and reported. The purpose of this paper is suggesting thin film-b
Publikováno v:
Microelectronics International, 2016, Vol. 33, Issue 1, pp. 53-60.
Externí odkaz:
http://www.emeraldinsight.com/doi/10.1108/MI-02-2015-0020
Publikováno v:
Microelectronics International, 2016, Vol. 33, Issue 1, pp. 15-22.
Externí odkaz:
http://www.emeraldinsight.com/doi/10.1108/MI-10-2014-0045
Publikováno v:
Soldering & Surface Mount Technology, 2015, Vol. 27, Issue 4, pp. 129-136.
Externí odkaz:
http://www.emeraldinsight.com/doi/10.1108/SSMT-03-2015-0006
Publikováno v:
Materials Today: Proceedings. 66:3053-3056