Zobrazeno 1 - 10
of 62
pro vyhledávání: '"M.W. Beranek"'
Publikováno v:
IEEE Transactions on Advanced Packaging. 24:576-585
A highly accurate prediction of hermeticity lifetime is made for eutectic 63Sn37Pb and 80Au20Sn alloy solder sealed optical fiber-Kovar/sup TM/ nosetube feedthroughs subjected to repetitive thermal cycling. Thermal fatigue fracture of the Sn-Pb solde
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::53642f918dfeca72089c0735c1d187d2
https://doi.org/10.1109/6040.982847
https://doi.org/10.1109/6040.982847
Autor:
P.j. Anthony, K.P. Fennessy, M.A. Occhionero, K.W. Davido, E.Y. Chan, Chiu-Chao Chen, M. Rassaian, L.T. Gomez, D.G. Koshinz, G.E. Henein, John Vanatta Gates, H.E. Hager, H.P. Soares, Joseph Shmulovich, R.L. St. Pierre, M. Cappuzzo, M.W. Beranek, Chi-Shain Hong
Publikováno v:
IEEE Transactions on Advanced Packaging. 23:461-469
Under the DARPA sponsored Avionics Optoelectronic Module Technology program, new passive alignment carrier (PAC) optical subassemblies (LED-PAC and PIN-PAC) ruggedized for military/aerospace avionics fiber-optic transmitter and receiver applications
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7e635c5c31880c45f3959ab7aaaa04a9
https://doi.org/10.1109/6040.861561
https://doi.org/10.1109/6040.861561
Autor:
M. Rassaian, M.W. Beranek
Publikováno v:
IEEE Transactions on Advanced Packaging. 22:86-93
Stress analysis of optical fiber solder bond joints on silicon micro-optical bench substrates under thermal cycle loading was investigated using two-dimensional (2-D) and three-dimensional (3-D) finite element analyses. Finite element simulations wer
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2af775e3f8b93147c2ce0d46e0af462f
https://doi.org/10.1109/6040.746547
https://doi.org/10.1109/6040.746547
Publikováno v:
Journal of Lightwave Technology. 11:2009-2014
A new type of compact (
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7f8de9f68082d8df3a1d0be97a25f3dd
https://doi.org/10.1109/50.257963
https://doi.org/10.1109/50.257963
Autor:
D.L. Livezey, D.G. Koshinz, M.W. Beranek, B.A. Capron, H.P. Soares, J.C. Bartella, D.M. Griffith
Publikováno v:
IEEE Transactions on Components, Hybrids, and Manufacturing Technology. 16:511-516
The materials and processes for fabricating a compact multiple-element slab waveguide spectrograph suitable for multimode fiber-optic wavelength-division-multiplexing (WDM) applications are described. A fabrication scheme based on thick-film solder g
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4d0dcbfa98edaf72fea47df16ca8fc23
https://doi.org/10.1109/33.239880
https://doi.org/10.1109/33.239880
Publikováno v:
IEEE Conference Avionics Fiber-Optics and Photonics, 2006..
In this paper we discuss the advantages (and disadvantages) of commercial sector gigabit fiber optic transceiver circuit evolution for avionics applications. We provide insight into some of the shortfalls that still exist with respect to avionics ind
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fe8be23bdac485fbac8e6d02231fb90d
https://doi.org/10.1109/avfop.2006.1707495
https://doi.org/10.1109/avfop.2006.1707495
Publikováno v:
Gateway to the New Millennium. 18th Digital Avionics Systems Conference. Proceedings (Cat. No.99CH37033).
Industry studies indicate the feasibility of using both MCM-L/COB and silicon microbench passive alignment technology in harsh, high reliability environments such as military and commercial avionics systems. Moreover, in many cases, if proper design,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::880a8f203702050788bd9a4cbea65708
https://doi.org/10.1109/dasc.1999.813693
https://doi.org/10.1109/dasc.1999.813693
Autor:
Jr. Glista A.S., M.W. Beranek
Publikováno v:
22nd Digital Avionics Systems Conference Proceedings (Cat No 03CH37449) DASC-03.
MIL-STD-1553 has become the de facto backbone avionics network over the last several decades. Avionics networks incorporating fiberoptic interconnects have recently evolved from point-to-point and ring network link designs with Mb/s LED sources and o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::55607e8ec6b69e4a6e463f7eb201c614
https://doi.org/10.1109/dasc.2003.1245942
https://doi.org/10.1109/dasc.2003.1245942
Publikováno v:
1996 Proceedings 46th Electronic Components and Technology Conference.
The commercial and military avionics/aerospace environment presents formidable challenges for developing and manufacturing low-cost avionics/aerospace-grade optoelectronic modules. Because manufacturing volume is relatively low, the economies of scal
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::184aa5d07bda452484543f9eabdf6380
https://doi.org/10.1109/ectc.1996.550878
https://doi.org/10.1109/ectc.1996.550878
Autor:
M. Rassaian, M.W. Beranek
Publikováno v:
1996 Proceedings 46th Electronic Components and Technology Conference.
Stress analysis of optical fiber solder bond joints on silicon substrates under thermal cycle loadings was investigated using 2-D and 3-D finite element analyses. Finite element simulations were carried out to investigate the effect of the distance b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::805eb391d54cdbc4dc157d18f41f07d1
https://doi.org/10.1109/ectc.1996.550902
https://doi.org/10.1109/ectc.1996.550902