Zobrazeno 1 - 10
of 28
pro vyhledávání: '"M.R. Tuck"'
Publikováno v:
IEEE Transactions on Components, Hybrids, and Manufacturing Technology. 14:529-535
A family of silicon test chips for use in making diagnostic measurements during electronics assembly has been developed. These assembly test chips (ATCs) contain sensors that measure a number of variables associated with assembled IC degradation, inc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::31aa0208f99f7ed35fa91fc7b426692b
https://doi.org/10.1109/33.83939
https://doi.org/10.1109/33.83939
Publikováno v:
1991 Proceedings 41st Electronic Components & Technology Conference.
Two devices which can be used to evaluate the ability of chip passivation or postbond coatings to protect a Si device from moisture penetration and resultant Al corrosion are described. The first device is a test chip with a number of Al triple track
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::48dd68ce2f86b26bdcc3508a03d4ed36
https://doi.org/10.1109/ectc.1991.163961
https://doi.org/10.1109/ectc.1991.163961
Publikováno v:
Ninth IEEE/CHMT International Symposium on Electronic Manufacturing Technology,Competitive Manufacturing for the Next Decade.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::744a988e4c52c2aea32328c9243bfade
https://doi.org/10.1109/iemt9.1990.115011
https://doi.org/10.1109/iemt9.1990.115011
Goal was Assembly Test Chips (ATCs) which could be used for evaluating plastic encapsulation technologies. Circuits were demonstrated for measuring Au-Al wirebond and Al metal corrosion failure rates during accelerated temperature and humidity testin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cf66c870b65c1bb31ae9b434287af170
https://doi.org/10.2172/520618
https://doi.org/10.2172/520618
Publikováno v:
MRS Proceedings. 225
Accurate moisture measurements in microelectronic assemblies are crucial in assessing reliability of integrated circuits (ICs). We describe the fabrication and use of a silicon-based device for evaluation of moisture barrier coatings. The capacitive
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9fec3fed6f2314155a7d7326e2901349
https://doi.org/10.1557/proc-225-313
https://doi.org/10.1557/proc-225-313
This report describes the features and use of the Sandia National Laboratories Assembly Test Chip Ver. 01 (ATC01). This chip contains a variety of Al conductor features which are intended for use in corrosion testing. These include triple tracks with
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dcd30b8c6c94be207d7863d5cfd2ba8b
https://doi.org/10.2172/6432269
https://doi.org/10.2172/6432269
Publikováno v:
IEEE Transactions on Nuclear Science. 21:776-783
A brief description of the EBR-II reactor and its supporting digital computer (which was designed to be transparent to the operator or experimenter) are discussed. Details of the system hardware and software are noted which allow the system to functi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::83261be86f498f4fbb0133c6218b7c3a
https://doi.org/10.1109/tns.1974.4327549
https://doi.org/10.1109/tns.1974.4327549
Kinetic studies are performed at EBR-II to ensure that the dynamic characteristics of the reactor indicate integrity of the system and surrounding environment. These studies are done by analysis of power perturbations caused by a drop rod and a rod o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::08e6fd7a5ec5e325b9aec7c71a735216
https://doi.org/10.2172/4311477
https://doi.org/10.2172/4311477